Jesse S. Jur

Dipole model explaining high-k/metal gate field effect transistor threshold voltage tuning

An interface dipole model explaining threshold voltage (Vt) tuning in HfSiON gated n-channel field effect transistors (nFETs) is proposed. Vt tuning depends on rare earth (RE) type and diffusion in Si∕SiOx∕HfSiON∕REOx/metal gated nFETs as follows: Sr<Er<Sc+Er<La<Sc<none. This Vt ordering is very similar to the trends in dopant electronegativity (EN) (dipole charge transfer) and ionic radius (r) (dipole separation) expected for a interfacial dipole mechanism. The resulting Vt dependence on RE dopant allows distinction between a dipole model (dependent on EN and r) and an oxygen vacancy model (dependent on valence).

Temperature-dependent subsurface growth during atomic layer deposition on polypropylene and cellulose fibers.

Nucleation and subsequent growth of aluminum oxide by atomic layer deposition (ALD) on polypropylene fiber substrates is strongly dependent on processing temperature and polymer backbone structure. Deposition on cellulose cotton, which contains ample hydroxyl sites for ALD nucleation and growth on the polymer backbone, readily produces a uniform and conformal coating. However, similar ALD processing on polypropylene, which contains no readily available active sites for growth initiation, results in a graded and intermixed polymer/inorganic interface layer. The structure of the polymer/inorganic layer depends strongly on the process temperature, where lower temperature (60 degrees C) produced a more abrupt transition. Cross-sectional transmission electron microscopy images of polypropylene fibers coated at higher temperature (90 degrees C) show that non-coalesced particles form in the near-surface region of the polymer, and the particles grow in size and coalesce into a film as the number of ALD cycles increases. Quartz crystal microbalance analysis on polypropylene films confirms enhanced mass uptake at higher processing temperatures, and X-ray photoelectron spectroscopy data also confirm heterogeneous mixing between the aluminum oxide and the polypropylene during deposition at higher temperatures. The strong temperature dependence of film nucleation and subsurface growth is ascribed to a relatively large increase in bulk species diffusivity that occurs upon the temperature-driven free volume expansion of the polypropylene. These results provide helpful insight into mechanisms for controlled organic/inorganic thin film and fiber materials integration.

Work function engineering using lanthanum oxide interfacial layers

A La2O3 capping scheme has been developed to obtain n-type band-edge metal gates on Hf-based gate dielectrics. The viability of the technique is demonstrated using multiple metal gates that normally show midgap work function when deposited directly on HfSiO. The technique involves depositing a thin interfacial of La2O3 on a Hf-based gate dielectric prior to metal gate deposition. This process preserves the excellent device characteristic of Hf-based dielectrics, but also allows the realization of band-edge metal gates. The effectiveness of the technique is demonstrated by fabricating fully functional transistor devices. A model is proposed to explain the effect of La2O3 capping on metal gate work function.

Atomic layer deposition and abrupt wetting transitions on nonwoven polypropylene and woven cotton fabrics.

Atomic layer deposition (ALD) of aluminum oxide on nonwoven polypropylene and woven cotton fabric materials can be used to transform and control fiber surface wetting properties. Infrared analysis shows that ALD can produce a uniform coating throughout the nonwoven polypropylene fiber matrix, and the amount of coating can be controlled by the number of ALD cycles. Upon coating by ALD aluminum oxide, nonwetting hydrophobic polypropylene fibers transition to either a metastable hydrophobic or a fully wetting hydrophilic state, consistent with well-known Cassie-Baxter and Wenzel models of surface wetting of roughened surfaces. The observed nonwetting/wetting transition depends on ALD process variables such as the number of ALD coating cycles and deposition temperature. Cotton fabrics coated with ALD aluminum oxide at moderate temperatures were also observed to transition from a natural wetting state to a metastable hydrophobic state and back to wetting depending on the number of ALD cycles. The transitions on cotton appear to be less sensitive to deposition temperature. The results provide insight into the effect of ALD film growth mechanisms on hydrophobic and hydrophilic polymers and fibrous structures. The ability to adjust and control surface energy, surface reactivity, and wettability of polymer and natural fiber systems using atomic layer deposition may enable a wide range of new applications for functional fiber-based systems.

Lanthanum silicate gate dielectric stacks with subnanometer equivalent oxide thickness utilizing an interfacial silica consumption reaction

A silicate reaction between lanthana and silica layers has been utilized to eliminate interfacial silica in metal-insulator-semiconductor devices and to obtain devices with very low equivalent oxide thickness EOT. This provides a simple process route to interface elimination, while producing a silicate dielectric with a higher temperature stability of the amorphous phase. The La2O3 layers in this study are deposited by reactive evaporation on 001 Si covered by a 0.8– 1.0-nm-thick SiO2 chemical oxide, and are capped in situ with a Ta gate, followed by a reaction anneal, which lowers the EOT from greater than 1.5 nm for the as-deposited bilayer stack to as low as 0.5 nm. Electron energy-loss spectroscopy and medium-energy ion scattering are used to show that a temperature of 400 °C is sufficient for the formation of the silicate gate dielectric. Gate leakage currents as low as 0.06 A / cm 2 are obtained for stacks having an EOT of 0.63 nm, orders of magnitude below that of SiO2 having the same EOT value. Electrical breakdown is observed at applied fields above 16 MV/ cm.

Surface and sub-surface reactions during low temperature aluminium oxide atomic layer deposition on fiber-forming polymers

Fundamental reaction processes between vapor-phase chemical precursors and high molecular weight polymers are important for polymer coating, encapsulation and surface modification. Using trimethylaluminium and water in an atomic layer deposition (ALD) exposure sequence, reactions between vapor-phase trimethylaluminium and common polymers with different substituents are quantified using in situ infrared transmission analysis. Exposing polypropylene to trimethylaluminium results in reactant uptake with minimal precursor/polymer reaction, but the precursor/water ALD sequence leads to subsurface alumina nucleation. A similar treatment to polyvinyl alcohol and polyamide-6 results in rapid precursor diffusion and significant reaction observed by IR, and the extent of reaction is consistent with results from in situ quartz crystal microgravimetry and transmission electron microscopy. Reacting trimethylaluminium with polyamide-6 leads to methyl group insertion into the amide carbonyl group and interaction with the hydrogen-bonded amine units. Multiple ALD reaction cycles produce film coatings on all polymers studied, but the coating structure depends strongly on the starting polymer composition. For the weakly interacting polypropylene, cross-sectional transmission electron microscopy demonstrates enhanced sub-surface growth at 90 °C as compared to that at 60 °C, while images of coated polyamide-6 fibers showed that growth is not strongly temperature dependent in that range. Micrograph images of polyamide-6 samples exposed to extended TMA doses revealed significant modification of the fiber surface region, demonstrating that the precursor could diffuse and react to depths in excess of 100 nm into the surface of the polymer at 90 °C. Improved understanding of specific precursor/polymer reaction pathways can be important to optimize the performance of conformal inorganic thin film coatings on polymers.

Dipole Moment Model Explaining nFET V t Tuning Utilizing La, Sc, Er, and Sr Doped HfSiON Dielectrics

A dipole moment model explaining Vt tuning in HfSiON gated nFETs is proposed and its impact on performance and reliability is presented. La, Sc, Er, and Sr dopants are utilized due to their differing electronegativities and ionic radii. These dopants tune Vt in the range of 250-600 mV. Vt tuning is found to be proportional to the net dipole moment associated with the Hf-O and rare earth (RE)-O bonds at the high-k/SiO2 interface. The magnitude of this interfacial dipole moment is determined by the electronegativities and ionic radii of the RE cations. LaOx is the most effective dopant based on Vt, mobility, and reliability,

Flexible Technologies for Self-Powered Wearable Health and Environmental Sensing

This article provides the latest advances from the NSF Advanced Self-powered Systems of Integrated sensors and Technologies (ASSIST) center. The work in the center addresses the key challenges in wearable health and environmental systems by exploring technologies that enable ultra-long battery lifetime, user comfort and wearability, robust medically validated sensor data with value added from multimodal sensing, and access to open architecture data streams. The vison of the ASSIST center is to use nanotechnology to build miniature, self-powered, wearable, and wireless sensing devices that can enable monitoring of personal health and personal environmental exposure and enable correlation of multimodal sensors. These devices can empower patients and doctors to transition from managing illness to managing wellness and create a paradigm shift in improving healthcare outcomes. This article presents the latest advances in high-efficiency nanostructured energy harvesters and storage capacitors, new sensing modalities that consume less power, low power computation, and communication strategies, and novel flexible materials that provide form, function, and comfort. These technologies span a spatial scale ranging from underlying materials at the nanoscale to body worn structures, and the challenge is to integrate them into a unified device designed to revolutionize wearable health applications.

Band-Engineered Low PMOS V T with High-K/Metal Gates Featured in a Dual Channel CMOS Integration Scheme

Using strained SiGe on Si, the threshold voltage of high k PMOS devices is reduced by as much as 300 mV. The 80 nm devices exhibit excellent short channel characteristics such as DIBL and GIDL. For the first time a dual channel scheme using standard activation anneal temperature is applied that allows La2O3 capping in NMOS and SiGe channel in PMOS to achieve acceptable values of threshold voltage for high kappa and metal gates for 32 nm node and beyond.

Thermally Stable N-Metal Gate MOSFETs Using La-Incorporated HfSiO Dielectric

We report a thermally stable N-metal process in which surface passivation of HfSiO dielectric using thin layers of La₂O₃, deposited by either MBE or PVD, significantly shifts the metal gate effective work function toward the Si conduction band edge. Well-behaved transistors with L_g down to 70 nm have been fabricated with threshold voltage of 0.25V, mobility up to 92% of the universal SiO₂ mobility, and T_inv ~1.6 nm