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Dive into the research topics where Jiaqi Hu is active.

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Featured researches published by Jiaqi Hu.


international conference on advances in production management systems | 2013

The Reverse Logistics Technology and Development Trend of Retired Home Appliances

Xin Zhao; Yonggao Fu; Jiaqi Hu; Ling Wang; Meiling Deng

This paper has introduced the status of retired home appliances reverse logistics industry in China , elaborated the key technologies which need to be focused on to enhance the development level of reverse logistics industry, including product life cycle information tracing technology , retired product quality detection technology , inventory optimization control technology, to build efficient reverse logistics information system and lead the industry to develop in the direction of informationization and standardization.


international symposium on advanced packaging materials | 2011

The effect of two different latent curing agents on the performance of anisotropic conductive adhesives

Bin Du; Xionghui Cai; Jiaqi Hu; Ling Wang; Hongqin Wang; Meiling Deng; Lijiao He; Chao Wan

To explore the effect of two different latent curing agents on the performance of anisotropic conductive adhesive (ACA), two adhesive with different latent curing agents (ACA1 and ACA2) were prepared and flexible radio frequency identification (RFID) tag inlays were assembled with them through flip chip technology. Curing profile and thermal stability of the pastes, microstructures and the bonding strength of ACA bonding joints, room temperature and hot humidity storage capacity of inlays were studied. It was found that the type of curing agent had much effect on the performance of ACAs. The ACA using B as the latent curing agent (ACA2) had lower curing peak temperature although it had lower Tg and smaller curing rate than the former (ACA1). After it cured there was less air bubbles in the resin. And it had better bonding strength and anti hot-humidity capacity than the former from other tests. This was important to the reliability of product. Thus, as a whole, latent curing agent B is more suitable to prepare the paste to assemble the flexible RFID tag inlays.


Archive | 2010

Compound heating soldering method of precise part resistance heat and supersonic vibration

Meiling Deng; Bin Du; Yuan Fang; Lijiao He; Jiaqi Hu; Hongjun Ji; Mingyu Li; Yongfei Lu; Hongqin Wang; Ling Wang; Pengcheng Wang; Xin Zhao


Archive | 2012

High-heat conductivity and electric conductivity die bonding adhesive for carbon nano tube-filled high-power light-emitting diode (LED)

Hongqin Wang; Ling Wang; Yonggao Fu; Chao Wan; Bin Du; Xin Zhao; Jiaqi Hu; Pengcheng Wang; Lijiao He; Meiling Deng; Nuo Cao; Lei Ding; Xunping Li


Archive | 2011

Solvent-free high-performance conductive adhesive

Hongqin Wang; Ling Wang; Chao Wan; Bin Du; Xin Zhao; Jiaqi Hu; Pengcheng Wang; Lijiao He; Meiling Deng


Archive | 2011

Resistance heat and ultrasonic vibration compound heating soldering equipment

Ling Wang; Mingyu Li; Hongjun Ji; Bin Du; Xin Zhao; Jiaqi Hu; Yongfei Lu; Pengcheng Wang; Hongqin Wang; Lijiao He; Meiling Deng


Archive | 2010

Waste gas reclamation treatment system for waste refrigerating electric appliances and method

Meiling Deng; Bin Du; Yuan Fang; Yonggao Fu; Lijiao He; Jiaqi Hu; Hongqin Wang; Ling Wang; Pengcheng Wang; Xin Zhao


Archive | 2009

Multi-station rotary type kinescope cutting machine

Xin Zhao; Biao Hu; Yonggao Fu; Jiaqi Hu; Lijiao He; Yuan Fang; Ling Wang


Archive | 2008

Waste and old electric appliance reclaiming handling system and method

Yonggao Fu; Xin Zhao; Jiaqi Hu; Ling Wang; Wei Wang; Wei Kong


Archive | 2011

Single-position image tube cutting machine

Xin Zhao; Biao Hu; Jiaqi Hu; Meiling Deng; Lijiao He; Ling Wang; Hongqin Wang; Pengcheng Wang; Bin Du; Chao Wan

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Ling Wang

Harbin Institute of Technology

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Hongjun Ji

Harbin Institute of Technology

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Mingyu Li

Harbin Institute of Technology

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Yongfei Lu

Harbin Institute of Technology

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Xionghui Cai

Wuhan Polytechnic University

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