Jing-Pin Pan
Industrial Technology Research Institute
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Publication
Featured researches published by Jing-Pin Pan.
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A | 1996
Syh-Ming Ho; Shy-Ming Lian; Ker-Ming Chen; Jing-Pin Pan; Tsung-Hsiung Wang; Aina Hung
The effectiveness of electroless Ni-B as a barrier metal to prevent the electrochemical migration between adjacent copper lines on a polyimide dielectric substrate was studied by measuring the resistance of the polyimide dielectric and by observing the electrochemical migration between the fine lines by reflective electron microscope after stress conditions. The rate-determining step associated with the electrochemical migration was also discussed.
Journal of Applied Polymer Science | 1992
Jing-Pin Pan; Gwo-Yuh Shiau; Song-Shiang Lin; Ker-Ming Chen
Archive | 2007
Chang-Rung Yang; Jing-Pin Pan; Chien-An Chen; Jung-Mu Hsu
Polymer Engineering and Science | 2011
Heng-Lei Su; Jung-Mu Hsu; Jing-Pin Pan; Tsung-Hsiung Wang; Fu-En Yu; Chorng-Shyan Chern
Journal of Applied Polymer Science | 2007
Heng-Lei Su; Jung-Mu Hsu; Jing-Pin Pan; Chorng-Shyan Chern
Journal of Applied Polymer Science | 1994
Han-Lung Chen; Syh-Ming Ho; Tsung-Hsiung Wang; Ker-Ming Chen; Jing-Pin Pan; S. M. Liang; Aina Hung
Polymer International | 2012
Quoc-Thai Pham; Jung-Mu Hsu; Jing-Pin Pan; Tsung-Hsiung Wang; Chorng-Shyan Chern
Polymer Engineering and Science | 2013
Fu-En Yu; Jung-Mu Hsu; Jing-Pin Pan; Tsung-Hsiung Wang; Chorng-Shyan Chern
Archive | 2007
Jing-Pin Pan; Chang-Rung Yang; Tsung-Hsiung Wang; Pin-Chi Chiang; Jung-Mu Hsu
Archive | 2011
Li-Duan Tsai; Yueh-Wei Lin; Chia-Chen Fang; Cheng-Liang Cheng; Jing-Pin Pan; Tsung-Hsiung Wang
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