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Featured researches published by Jinuk Kwon.


Korean Journal of Chemical Engineering | 2016

Heat dissipation properties of polyimide nanocomposite films

Jin-Young Kim; Jinuk Kwon; Daero Lee; Myeongsoo Kim; Haksoo Han

In development of modern electric fields, the growth of kinds of electronic devices has made the supply and research on heat dissipating films become important. To synthesize heat dissipation films with high thermal resistance for possible use in electronics applications, carbon black is doped into polyimide to increase the dissipating rate of films, at loadings of 50, 100, and 150 wt%. The resulting films display excellent thermal properties; the thermal conductivity of the film with 150 wt% carbon black is 5.59W∙m−1K−1, a value that is 35 times higher than that of pure polyimide (0.16W∙m−1K−1). To theoretically confirm the increased dissipating ability of composite films, the Nielsen equation is used for verification. The experimental results show an excellent fit with the theoretical values calculated by the Nielsen equation. The great thermal stability of polyimide composite film with carbon black is verified by using TGA and DSC, the temperature for 1% thermal decomposition of the 150wt% film is 541°C, and the glass transition temperature is 315 °C. The heat conduction results also show high heat dissipation data, which make the carbon black composite polyimide films an excellent candidate for use in electric devices to deplete the heat generated.


Macromolecular Research | 2014

Water sorption behavior in polyimide thin films controlled by inorganic additives

Jinuk Kwon; Jin-Young Kim; Dongmyung Park; Jongchul Seo; Patrick Han; Haksoo Han

AbstractWe investigated the decreased water diffusivity depending on the content and size of carbon black (CB) added to polyimide (PI) in order to synthesize composite films (PI-CB). CBs with different diameters were used: N110 (CB1, 11–19 nm), N326 (CB2, 26–30 nm) and N660 (CB3, 49–60 nm). The water diffusion coefficient of PI-CB decreased with increasing CB content from 2.67·10−9 for pure PI films to 0.22·10−9 cm2/s for PI-CB films containing 40 wt% CB1. Moreover, the decrease in water diffusivity with increasing CB content exhibited a linear relationship. The water diffusivity of PI-CB increased with the increasing size of CB at the same CB content. The water uptake of PI-CB had a linear relationship depending on the CB content, similar to water diffusivity; the water uptake of composite films decreased by 73% (from 3.67% to 0.98%) for PI-CB1 (40 wt%) films as compared to PI films. In addition, the water uptake varied not only with the CB content, but also by the size of the CB surface area.


Journal of Polymer Science Part A | 2004

Structure–property correlations of sulfonated polyimides. I. Effect of bridging groups on membrane properties

Choonkeun Lee; Saimani Sundar; Jinuk Kwon; Haksoo Han


Polymer Journal | 2016

Low-dielectric-constant polyimide aerogel composite films with low water uptake

Jin Young Kim; Jinuk Kwon; Myeongsoo Kim; Jeonguk Do; Daero Lee; Haksoo Han


Polymer | 2015

A novel synthesis method for an open-cell microsponge polyimide for heat insulation

Jinuk Kwon; Jin-Young Kim; Dongmyung Park; Haksoo Han


Journal of Polymer Science Part B | 2004

Nanoindentation studies of polyimide thin films with various internal linkages in the diamine component

Choonkeun Lee; Jinuk Kwon; Sunggook Park; Saimani Sundar; Byoungryul Min; Haksoo Han


Journal of Polymer Science Part B | 2004

Synthesis and characterization of poly(epoxy-imide) crosslinked networks

Seung-Jin Yang; Choonkeun Lee; Wonbong Jang; Jinuk Kwon; Saimani Sundar; Haksoo Han


Polymer Composites | 2014

Fabrication of polyimide composite films based on carbon black for high‐temperature resistance

Jinuk Kwon; Jin-Young Kim; Jeeeun Lee; Patrick Han; Dongmyung Park; Haksoo Han


Macromolecular Materials and Engineering | 2014

Preparation and Characterization of Spherical Polyimide Aerogel Microparticles

Jinuk Kwon; Jin-Young Kim; Taewon Yoo; Dongmyung Park; Haksoo Han


Macromolecular Materials and Engineering | 2006

Cover Picture: Macromol. Mater. Eng. 9/2014

Jinuk Kwon; Jin-Young Kim; Taewon Yoo; Dongmyung Park; Haksoo Han

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