Jiongjiong Gu

Inner lead-embedded flipped chip inverted T-shaped lockhole heat slug external radiator packaging structure

Encapsulation structure provided with embedded inner feet, invertedly-installed chip, radiation block and external radiation cap

Package structure with embedded inner pins, chip, inverted radiating block and external radiator

External cooling cap or board packaging structure of base-island embedded chip assembling lock hole radiating block

Packaging structure of base island-embedded chip upright heat dissipation block external radiator

Encapsulation structure provided with embedded inner feet, invertedly-installed chip, rectangular radiation block with lock hole, and external radiator

Inner lead-embedded flip chip packaging structure with inverted T-shaped heat sink externally connected with radiator

Island-embedded chip packaging structure with upright radiating block and external heating panel

Normal chip packaging structure with embedded substrate and heat sink having locking hole and connected with external heat-dissipating plate

External connection heat radiator encapsulation structure of positive installation reverse T-shaped heat radiation block of base island embedded chip