Joern Schwandt

Investigation of X-ray induced radiation damage at the Si-SiO2 interface of silicon sensors for the European XFEL

Experiments at the European X-ray Free Electron Laser (XFEL) require silicon pixel sensors which can withstand X-ray doses up to 1 GGy. For the investigation of X-ray radiation damage up to these high doses, MOS capacitors and gate-controlled diodes built on high resistivity n-doped silicon with crystal orientations and produced by two vendors, CiS and Hamamatsu, have been irradiated with 12 keV X-rays at the DESY DORIS III synchrotron light source. Using capacitance/conductance-voltage, current-voltage and thermal dielectric relaxation current measurements, the surface densities of oxide charges and interface traps at the Si-SiO2 interface, and the surface-current densities have been determined as function of dose. Results indicate that the dose dependence of the surface density of oxide charges and the surface-current density depend on the crystal orientation and producer. In addition, the influence of the voltage applied to the gates of the MOS capacitor and the gate-controlled diode during X-ray irradiation on the surface density of oxide charges and the surface-current density has been investigated at doses of 100 kGy and 100 MGy. It is found that both strongly depend on the gate voltage if the electric field in the oxide points from the surface of the SiO2 to the Si-SiO2 interface. Finally, annealing studies have been performed at 60°C and 80°C on MOS capacitors and gate-controlled diodes irradiated to 5 MGy and the annealing kinetics of oxide charges and surface current determined.

Study of radiation damage induced by 12 keV X-rays in MOS structures built on high-resistivity n-type silicon.

Imaging experiments at the European X-ray Free Electron Laser (XFEL) require silicon pixel sensors with extraordinary performance specifications: doses of up to 1 GGy of 12 keV photons, up to 10(5) 12 keV photons per 200 µm × 200 µm pixel arriving within less than 100 fs, and a time interval between XFEL pulses of 220 ns. To address these challenges, in particular the question of radiation damage, the properties of the SiO(2) layer and of the Si-SiO(2) interface, using MOS (metal-oxide-semiconductor) capacitors manufactured on high-resistivity n-type silicon irradiated to X-ray doses between 10 kGy and 1 GGy, have been studied. Measurements of capacitance/conductance-voltage (C/G-V) at different frequencies, as well as of thermal dielectric relaxation current (TDRC), have been performed. The data can be described by a dose-dependent oxide charge density and three dominant radiation-induced interface states with Gaussian-like energy distributions in the silicon band gap. It is found that the densities of the fixed oxide charges and of the three interface states increase up to dose values of approximately 10 MGy and then saturate or even decrease. The shapes and the frequency dependences of the C/G-V measurements can be quantitatively described by a simple model using the parameters extracted from the TDRC measurements.

Study of X-ray radiation damage in silicon sensors

The European X-ray Free Electron Laser (XFEL) will deliver 30,000 fully coherent, high brilliance X-ray pulses per second each with a duration below 100 fs. This will allow the recording of diffraction patterns of single complex molecules and the study of ultra-fast processes. Silicon pixel sensors will be used to record the diffraction images. In 3 years of operation the sensors will be exposed to doses of up to 1 GGy of 12 keV X-rays. At this X-ray energy no bulk damage in silicon is expected. However fixed oxide charges in the insulating layer covering the silicon and interface traps at the Si-SiO2 interface will be introduced by the irradiation and build up over time. We have investigated the microscopic defects in test structures and the macroscopic electrical properties of segmented detectors as a function of the X-ray dose. From the test structures we determine the oxide charge density and the densities of interface traps as a function of dose. We find that both saturate (and even decrease) for doses between 10 and 100 MGy. For segmented sensors the defects introduced by the X-rays increase the full depletion voltage, the surface leakage current and the inter-pixel capacitance. We observe that an electron accumulation layer forms at the Si-SiO2 interface. Its width increases with dose and decreases with applied bias voltage. Using TCAD simulations with the dose dependent parameters obtained from the test structures, we are able to reproduce the observed results. This allows us to optimize the sensor design for the XFEL requirements. In addition the Si-SiO2 interface region has been studied with time resolved signals induced by sub-nanosecond 660 nm laser light, which has a penetration of about 3 μm in silicon. Depending on the biasing history, humidity and irradiation dose, losses of either electrons or holes or no charge losses are observed. The relevance of these results for the sensor stability and performance is under investigation.

Challenges for silicon pixel sensors at the European XFEL

Abstract A systematic experimental study of the main challenges for silicon-pixel sensors at the European XFEL is presented. The high instantaneous density of X-rays and the high repetition rate of the XFEL pulses result in signal distortions due to the plasma effect and in severe radiation damage. The main parameters of X-ray-radiation damage have been determined and their impact on p + n sensors is investigated. These studies form the basis of the optimized design of a pixel-sensor for experimentation at the European XFEL.

Time dependence of charge losses at the Si-SiO2 interface in p + n-silicon strip sensors

The collection of charge carriers generated in p + n-strip sensors close to the Si-SiO2 interface before and after 1 MGy of X-ray irradiation has been investigated using the transient current technique with sub-nanosecond focused light pulses of 660 nm wavelength, which has an absorption length of 3.5 m in silicon at room temperature. The paper describes the measurement and analysis techniques used to determine the number of electrons and holes collected. Depending on biasing history, humidity and irradiation, incomplete collection of either electrons or holes is observed. The charge losses change with time. The time constants are dierent for electrons and holes and increase by two orders of magnitude when reducing the relative humidity from about 80 % to less than 1 %. An attempt to interpret these results is presented.

Study of X-ray radiation damage in the AGIPD sensor for the European XFEL

The European X-ray Free Electron Laser (XFEL), currently being constructed in Hamburg and planned to be operational in 2017 for users, will deliver 27,000 fully coherent, high brilliance X-ray pulses per second with duration less than 100 fs. The unique features of the X-ray beam pose major challenges for silicon detectors used at the European XFEL for imaging experiments, in particular a radiation tolerance of silicon sensors for doses up to 1 GGy for 3 years of operation at an operating voltage above 500 V. One of the detectors under development at the European XFEL is the Adaptive Gain Integrating Pixel Detector (AGIPD), which is a hybrid detector system with ASICs bump-bonded to p+n silicon pixel sensors. We have designed the silicon sensors for the AGIPD, which have been fabricated by SINTEF and delivered in the beginning of February 2013. To demonstrate the performance of the AGIPD sensor with regard to radiation hardness, mini-sensors with the same pixel and guard-ring designs as the AGIPD together with test structures have been irradiated at the beamline P11 of PETRA III with 8 keV and 12 keV monoenergetic X-rays to dose values up to 10 MGy. The radiation hardness of the AGIPD sensor has been proven and all electrical properties are within specification before and after irradiation. In addition, the oxide-charge density and surface-current density from test structures have been characterized as function of the X-ray dose and compared to previous measurements for test structures produced by four vendors.

Study of high-dose x-ray radiation damage of silicon sensors

The high intensity and high repetition rate of the XFEL, the European X-ray Free-Electron Laser presently under construction in Hamburg, results in X-ray doses of up to 1 GGy in silicon sensors for 3 years of operation. Within the AGIPD Collaboration the Hamburg group has systematically studied X-ray-radiation damage using test structures and segmented sensors fabricated on high-ohmic n-type silicon. MOS Capacitors and Gate- Controlled Diodes from 4 vendors with different crystal orientations and different technological parameters, as well as strip sensors have been irradiated in the dose range between 10 kGy and 1 GGy. Current-Voltage, Capacitance/Conductance-Voltage and Thermal Dielectric Relaxation Current measurements were used to extract oxide-charge densities, interface-trap densities and surface-current densities as function of dose and annealing conditions. The results have been implemented into TCAD simulations, and the radiation performance of strip sensors and guard-ring structures simulated and compared to experimental results. Finally, with the help of detailed TCAD simulations, the layout and technological parameters of the AGIPD pixel sensor have been optimized. It is found that the optimization for sensors exposed to high X-ray doses is significantly different than for non-irradiated sensors, and that the specifications of the AGIPD sensor can be met. In 2012 sensors have been ordered, the first batch has been delivered recently, and first results on a comparison between simulations and measurements will be presented.

Design and first tests of a radiation-hard pixel sensor for the European X-ray Free-Electron Laser

The high intensity and high repetition rate of the European X-ray Free-Electron Laser, presently under construction in Hamburg, requires silicon sensors which can stand X-ray doses of up to 1 GGy for 3 years of operation at high bias voltage. Within the AGIPD Collaboration the X-ray-radiation damage in MOS Capacitors and Gate-Controlled Diodes fabricated by four vendors on high-ohmic n-type silicon with two crystal orientations and different technological parameters, has been studied for doses between 1 kGy and 1 GGy. The extracted values of oxide-charge and surface-current densities have been used in TCAD simulations, and the layout and technological parameters of the AGIPD pixel sensor optimized. It is found that the optimized layout for high X-ray doses is significantly different from the one for non-irradiated sensors. First sensors and test structures have been delivered in early 2013. Measurement results for X-ray doses of 0 to 10 MGy and their comparison to simulations are presented. They demonstrate that the optimization has been successful and that the sensors fulfill the required specifications.

Investigation of the insulator layers for segmented silicon sensors before and after X-ray irradiation

For the proper simulation and understanding of segmented silicon sensors the surface boundary conditions and the charge density distribution in the SiO2 layer (and other insulator layers if present), as well as at the Si-SiO2 interface have to be known. It has been observed previously, that the boundary conditions on the sensor surface change with relative humidity, RH. We therefore have measured the surface conductivity of SiO2-Si3N4 at room temperature for RH values between 30 and 46 % using a Gate Controlled Diode fabricated on n-type high-ohmic Si, and for RH = 50 % using a MOSFET. For determining the effective oxide-charge density, Noxeff, which is required for sensor simulations, as function of ionizing dose and biasing conditions, capacitance-voltage-frequency (C-V-f ) measurements on MOS capacitors (MOS-C) irradiated up to SiO2 doses of 1 GGy by ~10 keV X-rays were performed previously. Large hysteresis effects were observed when the voltage was ramped from accumulation to strong inversion and back. We interpreted these shifts as evidence for field-enhanced injection of charges from the Si into the SiO2. Here we present C- V-f measurements on MOS-Cs fabricated on <;100> and <;111> high-ohmic Si, without irradiation and after X-ray irradiation to 1 GGy. In order to determine the time- and field-dependence of the injection of positive charges from the Si into the SiO2, the MOS-Cs have been biased at different voltages in inversion for different time intervals.