Johan W. Berenschot

Micromachining of buried micro channels in silicon

A new method for the fabrication of micro structures for fluidic applications, such as channels, cavities, and connector holes in the bulk of silicon wafers, called buried channel technology (BCT), is presented in this paper. The micro structures are constructed by trench etching, coating of the sidewalls of the trench, removal of the coating at the bottom of the trench, and etching into the bulk of the silicon substrate. The structures can be sealed by deposition of a suitable layer that closes the trench. BCT is a process that can be used to fabricate complete micro channels in a single wafer with only one lithographic mask and processing on one side of the wafer, without the need for assembly and bonding. The process leaves a substrate surface with little topography, which easily allows further processing, such as the integration of electronic circuits or solid-state sensors. The essential features of the technology, as well as design rules and feasible process schemes, will be demonstrated on examples from the field of /spl mu/-fluidics.

Resistless patterning of sub-micron structures by evaporation through nanostencils

We describe a sub-micron shadow-mask evaporation or nanostencil technique for single-layer material patterning. The technique does not involve photoresist processing steps and is therefore applicable on arbitrary surfaces. It allows for rapid fabrication of sub-micron structures on a milimeter scale. The nanostencils used here are thin microfabricated silicon nitride membranes, 1 x 3 mm wide and 0.3-1.0 @mm thick. They are peforated by a regular two-dimensional array of sub-micron apertures of 1 @mm periode. Metal evaporation of 40 nm thick Cr/Au through the apertures directly onto the substrate yields the exact 1:1 replication of the aperture pattern. The smallest dot size on a flat substrate obtained is 120 nm, whereas 750 nm dots are reproduced, both on free-standing micromechanical beams and on a surface recessed by 5-10 @mm.

A micromachined pressure/flow-sensor

The micromechanical equivalent of a differential pressure flow-sensor, well known in macro mechanics, is discussed. Two separate pressure sensors are used for the device, enabling to measure both, pressure as well as volume flow-rate. An integrated sensor with capacitive read-out as well as a hybrid, piezo-resistive variant is made. The fabrication processes are described, using silicon and glass processing techniques. Based on the sensor layout, equations are derived to describe the sensor behavior both statically as well as dynamically. With the derived equations, the working range of the sensor and the thermal and time stability is estimated. The computed results of the stationary behavior are verified with the measured data. A good similarity in linearity of the pressure/flow relation is found. The computed hydraulic resistance, however, differs from the measured value for water with 21%. This difference can be explained by the high sensitivity of the resistance to the resistor channel cross-section parameter in combination with the difference between the rounded etched shape and the rectangular approximation. From fluid dynamics simulations, a working range bandwidth of about 1 kHz is expected. Thermal influences on the sensor signal due to viscosity changes are in the order of 2% flow signal variation per Kelvin. From these results, it can be concluded that the sensor can be used as a low cost, low power consuming flow and pressure-sensing device, for clean fluids without particles and without the tendency to coat the channel walls. If a high accuracy is wanted, an accurate temperature sensing or controlling system is needed.

High resolution powder blast micromachining

Powder blasting, or Abrasive Jet Machining (AJM), is a technique in which a particle jet is directed towards a target for mechanical material removal. It is a fast, cheap and accurate directional etch technique for brittle materials like glass, silicon and ceramics. By introducing electroplated copper as a new mask material, the feature size of this process was decreased. It was found that blasting with 9 /spl mu/m particles (compared with 30 /spl mu/m particles) result in a higher slope of the channel sidewall. The aspect ratio of powder blasted channels was increased by using the high resistance of the copper mask in combination with the use of 9 /spl mu/m particles. Furthermore, our measurements show how the blast lag (small channels etch slower compared to wider channels) is decreased by using smaller particles.

Mask materials for powder blasting

Powder blasting, or abrasive jet machining (AJM), is a technique in which a particle jet is directed towards a target for mechanical material removal. It is a fast, cheap and accurate directional etch technique for brittle materials such as glass, silicon and ceramics. The particle jet (which expands to about 1 cm in diameter) can be optimized for etching, while the mask defines the small and complex structures. The quality of the mask influences the performance of powder blasting. In this study we tested and compared several mask types and added a new one: electroplated copper. The latter combines a highly resistant mask material for powder blasting with the high-resolution capabilities of lithography, which makes it possible to obtain an accurate pattern transfer and small feature sizes (<50 µm).

Micromachined fountain pen for atomic force microscope-based nanopatterning

We present a tool that can be used in standard atomic force microscope and that enables chemical, chemical/mechanical, or physical surface modification using continuous liquid supply. The device consists of a reservoir micromachined into the probe support that is connected to fluidic channels embedded in a V-shaped cantilever. Via the fluidic channels, the liquid reaches the tip. The fluid transport to the sample surface is demonstrated and fountain pen lithography applications are presented.

Etching methodologies in -oriented silicon wafers

New methodologies in anisotropic wet-chemical etching of -oriented silicon, allowing useful process designs combined with smart mask-to-crystal-orientation-alignment are presented in this paper. The described methods yield smooth surfaces as well as high-quality plan-parallel beams and membranes. With a combination of pre-etching and wall passivation, structures can be etched at different depths in a wafer. Designs, using the -crystal orientation, supplemented with pictures of fabricated devices, demonstrate the potential of using -oriented wafers in microsystem design.

High-resolution shadow-mask patterning in deep holes and its application to an electrical wafer feed-through

The paper presents a technique to pattern materials in deep holes and/or on non-planar substrate surfaces. A rather old technique, namely, electron-beam evaporation of metals through a shadow mask, is used. The realization of high-resolution shadow masks using micromachining techniques is described. Further, a low ohmic electrical wafer foed-through with a small parasitic capacitance to the substrate and a high placing density is presented.

Direct integration of micromachined pipettes in a flow channel for single DNA molecule study by optical tweezers

We have developed a micromachined flow cell consisting of a flow channel integrated with micropipettes. The flow cell is used in combination with an optical trap setup (optical tweezers) to study mechanical and structural properties of /spl lambda/-DNA molecules. The flow cell was realized using silicon micromachining including the so-called buried channel technology to fabricate the micropipettes, the wet etching of glass to create the flow channel, and the powder blasting of glass to make the fluid connections. The volume of the flow cell is 2 /spl mu/l. The pipettes have a length of 130 /spl mu/m, a width of 5-10 /spl mu/m, a round opening of 1 /spl mu/m and can be processed with different shapes. Using this flow cell we stretched single molecules (/spl lambda/-DNA) showing typical force-extension curves also found with conventional techniques. These pipettes can be also used for drug delivery, for injection of small gas bubbles into a liquid flow to monitor the streamlines, and for the mixing of liquids to study diffusion effects. The paper describes the design, the fabrication and testing of the flow cell.

A versatile surface channel concept for microfluidic applications

MEMS fluidic devices often require the integration of transducer structures with freely suspended microchannels. In this paper a versatile microchannel fabrication concept is presented, allowing for easy fluidic interfacing and integration of transducer structures in close proximity to the fluid. This is achieved by the reliable fabrication of completely sealed microchannels directly below the substrate surface. The resulting planar substrate surface allows for the deposition of transducer material and pattern transfer by lithography. The microchannels are subsequently released and fluidic entrance holes are created, while the transducer structures can be protected by photoresist. Several monolithic microfluidic device structures have been fabricated, demonstrating the versatility of the concept. Fabricated surface microchannel devices can optionally be vacuum sealed by anodic bonding.