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Dive into the research topics where John A. Kramar is active.

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Featured researches published by John A. Kramar.


Measurement Science and Technology | 2005

Review of SI traceable force metrology for instrumented indentation and atomic force microscopy

Jon R. Pratt; John A. Kramar; David B. Newell; Douglas T. Smith

This paper reviews the current status of small force metrology for quantitative instrumented indentation and atomic force microscopy (AFM), and in particular focuses on new electrical and deadweight standards of force developed at the National Institute of Standards and Technology (NIST). These standards provide metrological infrastructure so that users of instrumented indentation and AFM can achieve quantitative nanomechanical testing of materials, engineered surfaces and micro and nanoscale devices in terms of forces that are expressed in internationally accepted units of measure with quantified uncertainty.


Measurement Science and Technology | 2005

Nanometre resolution metrology with the Molecular Measuring Machine

John A. Kramar

Nanometre accuracy and resolution metrology over technically relevant areas is becoming a necessity for the progress of nanomanufacturing. At the National Institute of Standards and Technology, we are developing the Molecular Measuring Machine, a scanned probe microscope (SPM) and Michelson interferometer based metrology instrument, designed to achieve nanometre measurement uncertainty for point-to-point measurements over a 50 mm by 50 mm working area. The salient design features are described, along with example measurements that demonstrate the measurement capabilities so far achieved. Both long-range measurements of sub-micrometre pitch gratings over 10 mm, and short-range, high-resolution measurements of a molecular crystal lattice have been accomplished. The estimated relative measurement uncertainty so far attained for pitch measurements is 6 × 10−5, coverage factor k = 2. We have also used this instrument and scanning probe oxidation lithography for creating some simple nanometre dimension patterns that could serve as prototype calibration standards, utilizing the SPM probe tip positioning accuracy.


Precision Engineering-journal of The International Societies for Precision Engineering and Nanotechnology | 1993

Electronic limitations in phase meters for heterodyne interferometry

Nile M. Oldham; John A. Kramar; P. S. Hetrick; E C. Teague

Abstract Limitations imposed by the phase meters used in heterodyne interferometers are evaluated. These instruments measure the phase relationship between electrical signals generated by the heterodyning process, allowing the interferometers to resolve fractions of an optical fringe. Measurements indicate that the phase meters used in currently available heterodyne interferometers probably limit achievable accuracy to a greater extent than barriers imposed by the optics. We show that a new class of time interval counters offers a means of greatly improving accuracy in these instruments.


Measurement Science and Technology | 2011

Scanning probe microscope dimensional metrology at NIST

John A. Kramar; Ronald G. Dixson; Ndubuisi G. Orji

Scanning probe microscope (SPM) dimensional metrology efforts at the US National Institute of Standards and Technology (NIST) are reviewed in this paper. The main SPM instruments for realizing the International System of Units (SI) are the Molecular Measuring Machine, the calibrated atomic force microscope and the critical dimension atomic force microscope. These are optimized for long-distance measurements, three-dimensional measurements over conventional SPM distances and critical dimension or linewidth measurements, respectively. 10 mm distances have been measured with the relative standard uncertainty, uc, of 1.5 × 10−5; step heights at the 100 nm scale have been measured with the relative uc of 2.5 × 10−3 and sub-micrometer linewidths have been measured with uc = 0.8 nm.


Journal of Research of the National Institute of Standards and Technology | 2011

Atomic Force Microscope Cantilever Flexural Stiffness Calibration: Toward a Standard Traceable Method.

Richard S. Gates; Mark Reitsma; John A. Kramar; Jon R. Pratt

The evolution of the atomic force microscope into a useful tool for measuring mechanical properties of surfaces at the nanoscale has spurred the need for more precise and accurate methods for calibrating the spring constants of test cantilevers. Groups within international standards organizations such as the International Organization for Standardization and the Versailles Project on Advanced Materials and Standards (VAMAS) are conducting studies to determine which methods are best suited for these calibrations and to try to improve the reproducibility and accuracy of these measurements among different laboratories. This paper expands on a recent mini round robin within VAMAS Technical Working Area 29 to measure the spring constant of a single batch of triangular silicon nitride cantilevers sent to three international collaborators. Calibration techniques included reference cantilever, added mass, and two forms of thermal methods. Results are compared to measurements traceable to the International System of Units provided by an electrostatic force balance. A series of guidelines are also discussed for procedures that can improve the running of round robins in atomic force microscopy.


Proceedings of SPIE | 2011

TSOM Method for Semiconductor Metrology

Ravikiran Attota; Ronald G. Dixson; John A. Kramar; James E. Potzick; Andras Vladar; Benjamin Bunday; Erik Novak; Andrew C. Rudack

Through-focus scanning optical microscopy (TSOM) is a new metrology method that achieves 3D nanoscale measurement sensitivity using conventional optical microscopes; measurement sensitivities are comparable to what is typical when using scatterometry, scanning electron microscopy (SEM), and atomic force microscopy (AFM). TSOM can be used in both reflection and transmission modes and is applicable to a variety of target materials and shapes. Nanometrology applications that have been demonstrated by experiments or simulations include defect analysis, inspection and process control; critical dimension, photomask, overlay, nanoparticle, thin film, and 3D interconnect metrologies; line-edge roughness measurements; and nanoscale movements of parts in MEMS/NEMS. Industries that could benefit include semiconductor, data storage, photonics, biotechnology, and nanomanufacturing. TSOM is relatively simple and inexpensive, has a high throughput, and provides nanoscale sensitivity for 3D measurements with potentially significant savings and yield improvements in manufacturing.


Review of Scientific Instruments | 2004

Sliding mode control for active vibration isolation of a long range scanning tunneling microscope

Kuo-Jung Lan; Jia-Yush Yen; John A. Kramar

An active vibration isolation (AVI) system has been designed and implemented for the Molecular Measuring Machine (M3) at the National Institute of Standards and Technology (NIST). NIST is investigating active vibration isolation as an approach to improving the M3 image resolution and measurement speed. This article presents the full dynamic model of the AVI system with the Mallock suspension used for the M3 system suspension. A decoupling process is employed to decompose the complicate dynamics into separate axis. This article then applied a sliding mode controller (SMC) to overcome the system nonlinearities. Experimental results show that the controller is effective, achieving a vibration attenuation of 10 dB at some frequencies, depending on the axis.


Proceedings of SPIE, the International Society for Optical Engineering | 1999

Toward nanometer accuracy measurements

John A. Kramar; Edward Amatucci; David E. Gilsinn; Jau-Shi Jay Jun; William B. Penzes; Fredric Scire; E. Clayton Teague; John S. Villarrubia

We at NIST are building a metrology instrument called the Molecular Measuring Machine (MMM) with the goal of performing 2D point-to-point measurements with one nanometer accuracy cover a 50 mm by 50 mm area. The instrument combines a scanning tunneling microscope (STM) to probe the surface and a Michelson interferometer system to measure the probe movement, both with sub-nanometer resolution. The instrument also feature millidegree temperature control at 20 degrees C, an ultra-high vacuum environment with a base pressure below 10-5 Pa, and seismic and acoustic vibration isolation. High-accuracy pitch measurements have been performed on 1D gratings. In one experiment, the MMM STM probe imaged an array of laser-focused, atomically deposited chromium lines over an entire 5 micrometers by 1 mm area. Analysis of the data yielded an average line spacing of 212.69 nm with a 5 pm standard uncertainty. The uncertainty estimate is derived for an analysis of the sources of uncertainty for a 1 mm point-to-point measurement, including the effects of alignment, Abbe offset, motion cross-coupling, and temperature variations. In another measurement, the STM probe continuously tracked a holographically-produced grating surface for 10 mm, counting out 49,996 lines and measuring an average line spacing of 200.011 nm with a 5 pm standard uncertainty.


Review of Scientific Instruments | 2008

SI traceable calibration of an instrumented indentation sensor spring constant using electrostatic force

Koo-Hyun Chung; Stefan Scholz; Gordon A. Shaw; John A. Kramar; Jon R. Pratt

We present a measurement scheme for creating reference electrostatic forces that are traceable to the International System of Units. This scheme yields reference forces suitable for calibrating the force sensitivity of instrumented indentation machines and atomic force microscopes. Forces between 10 and 200 muN were created and expressed in terms of the voltage, length, and capacitance between a pair of interacting electrodes. The electrodes comprised an electrically conductive sphere mounted as a tip on an instrumented indentation sensor, and a planar counterelectrode fixed to a sample stage in close proximity to the sphere. For comparison, we applied mechanical forces of similar magnitudes, first using deadweights and then using a reference force sensor. The deflection of the sensor due to the various applied forces was measured using an interferometer. A spring constant for the sensor was computed from the observed records of force versus displacement. Each procedure yielded a relative standard uncertainty of approximately 1%; however, the electrostatic technique is scalable and could provide traceable reference forces as small as a few hundred piconewtons, a range far below anything yet achieved using deadweights.


international conference on microelectronic test structures | 1995

Measurement of patterned film linewidth for interconnect characterization

Loren W. Linholm; Richard A. Allen; Michael W. Cresswell; Rathindra N. Ghoshtagore; Santos D. Mayo; Harry A. Schafft; John A. Kramar; E C. Teague

Test results from high-quality electrical and physical measurements on the same cross-bridge resistor test structure with approximately vertical sidewalls have shown differences in linewidth as great as 90 nm for selected conductive films. These differences were independent of design linewidth. As dimensions become smaller, the accurate measurement of the patterned conductor width is necessary to assure predictable timing performance of the interconnect system as well as control of critical device parameters.

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Jon R. Pratt

National Institute of Standards and Technology

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David B. Newell

National Institute of Standards and Technology

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Gordon A. Shaw

National Institute of Standards and Technology

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Douglas T. Smith

National Institute of Standards and Technology

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Fredric Scire

National Institute of Standards and Technology

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Andras Vladar

National Institute of Standards and Technology

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E C. Teague

National Institute of Standards and Technology

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William B. Penzes

National Institute of Standards and Technology

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John S. Villarrubia

National Institute of Standards and Technology

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Michael T. Postek

National Institute of Standards and Technology

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