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Featured researches published by John Bultitude.


Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) | 2012

SMD and Leaded Ceramic Capacitors for High Temperature Applications

Abhijit Gurav; Xilin Xu; Jim Magee; John Bultitude; Travis Ashburn

For high temperature applications at 150°C or above, such as in electronics for down-hole drilling, geothermal energy generation, power electronics and automotive under the hood electronics, a robust dielectric material is necessary for capacitors. Common X7R and X8R type ceramic capacitors are designed for applications up to 125°C and 150°C, respectively. At temperatures above 150°C, these types of capacitors typically suffer from degradation of reliability performance and severe reduction in capacitance, especially under DC bias conditions. Recently, a Class-I dielectric material has been developed using Nickel electrodes for high temperature application up to 200–250°C. Due to its linear dielectric nature, this material exhibits highly stable capacitance as a function of temperature and voltage. Multi-layer ceramic capacitors (MLCCs) made from this material can be qualified as X9G. This paper will report electrical properties and reliability test data on these Class-I type ceramic capacitors in SMD chi...


2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) | 2016

An evaluation of BME C0G multilayer ceramic capacitors as building blocks for DC-Link capacitors in 3-D power electronics

John Bultitude; Lonnie G. Jones; Buli Xu; Jim Magee; Reggie Phillips

Multilayer ceramic capacitors manufactured with different designs using a C0G Ni BME technology are evaluated as building blocks for DC-Link capacitors. Electrical and physical properties are compared to a commercially available DC-Link ceramic capacitor. Reliability evaluations at 600V and 200°C show that capacitors made with the C0G Ni BME have excellent reliability as well as high current handling capability that result in high power density. These properties coupled with high modulus of rupture, good board flexure resistance and thermal cycling capability make them excellent candidates for building blocks in 3D power electronics to meet higher temperature, voltage and switching frequency requirements. The benefits and limitations of transient liquid phase sintering materials and processes to replace solders for packaging are discussed.


Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) | 2013

Advanced Ceramic Capacitor Solutions for High Temperature Applications

Abhijit Gurav; Xilin Xu; Jim Magee; Paul Staubli; John Bultitude; Travis Ashburn

For high temperature applications at 150°C or above, such as those in electronics for down-hole drilling, geothermal energy generation and power electronics, a robust dielectric material is necessary for capacitors. Ceramic capacitors using X7R and X8R type dielectrics are designed for applications up to 125°C and 150°C, respectively. At temperatures above 150°C, these X7R/X8R types of ceramic capacitors typically suffer from degradation of reliability performance and severe reduction in capacitance, especially when bias is applied. Recently, a Class-I dielectric material has been developed using Nickel electrodes for high temperature application up to 200–250°C. Due to its linear dielectric nature, this material exhibits highly stable capacitance as a function of temperature and voltage. This paper will report electrical properties and reliability test data on these Class-I type ceramic capacitors in SMD chip and leaded configurations at 150–200°C and above, and discuss possible mechanisms behind the rob...


Archive | 2010

Externally fused and resistively loaded safety capacitor

John Bultitude; John E. McConnell


Archive | 2012

Overvoltage protection component

John Bultitude; Lonnie G. Jones; Jeffrey W. Bell


Archive | 2010

High capacitance multilayer with high voltage capability

John Bultitude; James R. Magee; Lonnie G. Jones


Journal of Materials Science: Materials in Electronics | 2015

High temperature capacitors and transient liquid phase interconnects for Pb-solder replacement

John Bultitude; John E. McConnell; Catherine Shearer


Archive | 2010

Leaded multi-layer ceramic capacitor with low esl and low esr

John E. McConnell; Reggie Phillips; Alan P. Webster; John Bultitude; Mark Laps; Lonnie G. Jones; Garry Renner


Archive | 2013

Leadless multi-layered ceramic capacitor stacks

John E. McConnell; Garry Renner; John Bultitude; Allen Hill


Archive | 2011

Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes

John E. McConnell; John Bultitude; Reggie Phillips; Robert Allen Hill; Garry Renner; Philip M. Lessner; Antony P. Chacko; Jeffrey W. Bell; Keith Brown

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