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John H. Dungan

Intel

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Publication

Featured researches published by John H. Dungan.

Archive | 2003

PCB design and method for providing vented blind vias

David W. Boggs; John H. Dungan; Gary I. Paek; Daryl Sato

Archive | 2001

VENTED VIAS FOR VIA IN PAD TECHNOLOGY YIELD IMPROVEMENTS

Carolyn R. McCormick; Rebecca A. Jessep; John H. Dungan; David W. Boggs; Daryl Sato

Archive | 2004

Three-dimensional flexible interposer

David W. Boggs; John H. Dungan; Frank A. Sanders; Daryl Sato; Dan Willis

Archive | 2003

Electronic substrate with direct inner layer component interconnection

David W. Boggs; Daryl Sato; John H. Dungan; Gary Paek

Archive | 2003

Apparatus for providing an integrated printed circuit board registration coupon

David W. Boggs; John H. Dungan; Daryl Sato

Archive | 2002

Standoff devices and methods of using same

Rebecca A. Jessep; David W. Boggs; Carolyn R. McCormick; John H. Dungan; Daryl Sato

Archive | 2003

Method and apparatus for providing an integrated printed circuit board registration coupon

David W. Boggs; John H. Dungan; Daryl Sato

Archive | 2001

Coupon registration mechanism and method

David W. Boggs; Rebecca A. Jessep; Carolyn R. McCormick; Daryl Sato; John H. Dungan

Archive | 2007

ELECTRONIC PACKAGING USING CONDUCTIVE INTERPROSER CONNECTOR

David W. Boggs; John H. Dungan; Frank A. Sanders; Daryl Sato; Dan Willis

Archive | 2002

PCB method and apparatus for producing landless interconnects

David W. Boggs; Daryl Sato; John H. Dungan; Gary I. Paek

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Collaboration

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Daryl Sato

Intel

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David W. Boggs

Intel

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Carolyn R. McCormick

Intel

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Rebecca A. Jessep

Intel

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Dan Willis

Intel

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Frank A. Sanders

Intel

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Rebecca Jessup

Intel

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