John P. Henley
Dow Chemical Company
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Featured researches published by John P. Henley.
Aerosol Science and Technology | 1993
Alan W. Weimer; Gene A. Cochran; Glenn A. Eisman; John P. Henley; Theresa A. Guiton; Arne K. Knudsen; Nick R. Nicholas
Thermophoretic deposition in an exothermic aluminum (AI) nitridation aerosol process was redirected from the reactor wall to a flowing inert powder when the inert powder was admixed with the feed atomized AI. The inert powder can be a compatible (aluminum nitride) or removable (carbon) powder, which provides for a lower-temperature surface to be in close proximity to the exothermic reaction sites. Aluminum nitride manufactured by this process was pressurelessly sintered with 3 wt% Y2O3 to fabricate dense AIN parts exhibiting high thermal conductivity (141 W/m – K).
Journal of the American Ceramic Society | 1994
Alan W. Weimer; Gene A. Cochran; Glenn A. Eisman; John P. Henley; Bruce D. Hook; Lynne K. Mills; Theresa A. Guiton; Arne K. Knudsen; Nicholas R. Nicholas; James E. Volmering; William G. Moore
Archive | 1988
John P. Henley; Stanley R. Pearson; Bruce C. Peters; Larry L. LaFitte
Archive | 2000
John P. Henley; Mark E. Jones; Daniel A. Hickman; Kenric A. Marshall; Daniel J. Reed; William D. Clarke; Michael M. Olken; Lee E. Walko
Archive | 1992
John P. Henley; Gene A. Cochran; David A. Dunn; Glenn A. Eisman; Alan W. Weimer
Archive | 1991
Alan W. Weimer; Raymond P. Roach; John P. Henley
Archive | 1994
Stephen D. Dunmead; William G. Moore; Alan W. Weimer; Glenn A. Eisman; John P. Henley
Archive | 2002
William D. Clarke; Terry D. Haymon; John P. Henley; Daniel A. Hickman; Mark E. Jones; Matt C. Miller; Thomas E. Morris; Daniel J. Reed; Lawrence J. Samson; Albert E. Schweizer; Steve A. Smith
Archive | 2002
William D. Clarke; Terry D. Haymon; John P. Henley; Daniel A. Hickman; Mark E. Jones; Matt C. Miller; Thomas E. Morris; Daniel J. Reed; Lawrence J. Samson; Steven A. Smith
Archive | 1991
Alan W. Weimer; John P. Henley; Gene A. Cochran; Glenn A. Eisman; William G. Moore