John P. Whitlock
Hewlett-Packard
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Publication
Featured researches published by John P. Whitlock.
international reliability physics symposium | 1986
Tim Koch; Wayne Richliug; John P. Whitlock; Dave Hall
Intermittent continuity failures of P-DIP parts were found to be the result of wire bond failures induced by stresses associated with the assembly process. The bond failures were characterized by cracking of the underlying pad structure. It was found that silicon nodule precipitates from the aluminum metallization in the pad acted as points of high stress during the bonding of gold to the pad regions. By altering the bonding parameters and the underlying pad structure, failure of the bonds could be prevented.
Archive | 2000
Ravi Ramaswami; Victor Joseph; Min Cao; Theodore I. Kamins; John P. Whitlock; Anil Prem
Archive | 2000
Martha A. Truninger; Phillip R. Coffman; Charles C. Haluzak; John P. Whitlock; Douglas A. Sexton
Archive | 2009
John P. Whitlock; Scott Lerner; David G. Leigh; Stephan R. Clark
Archive | 2002
Zhizang Chen; Genbao Xu; Mark Alan Johnstone; John P. Whitlock
Archive | 1997
Michael J. Regan; Brian J. Keefe; Ali Emamjomeh; Roger J Kolodziej; Ulrich E. Hess; John P. Whitlock; Domingo A. Figueredo; Gregory T Hindman
Archive | 1996
John P. Whitlock; George H. Corrigan
Archive | 2002
Genbao Xu; Zhizang Chen; Mark Alan Johnstone; John P. Whitlock
Archive | 2010
Stephan R. Clark; Karl S. Weibezahn; John P. Whitlock; Scott Lerner
Archive | 2009
Karl S. Weibezahn; Stephan R. Clark; Scott Lerner; John P. Whitlock
