John Philip Franey

The Corrosion of Electronic Resistors

Precision thick chip resistors are used in a variety of different industries, from telecommunications to automotive electronics, and as such can be exposed to mild and aggressive corrosive environments. This paper investigates the corrosion performance of two generic precision thick chip resistors in a controlled corrosive atmosphere consisting of 60degC, 4 ppm H2S and water vapor in purified air. The resistors were exposed in an environmental chamber for periods of 5, 10, 15, 30, and 60 days. Following exposure, the samples were cross sectioned and subjected to surface analysis using microscopy and microanalysis. After the initial stages of exposure, corrosion was observed on only one of the two types of resistors. The corrosion developed because H2S gas and water vapor diffuses through the thin protective organic layer on the resistor, and subsequently reacts with the silver conductor layer. Corrosion was facilitated by poor overlapping of the solder and nickel layer and, in particular the glass binder over the glass overcoat, which allowed silver and sulphur to diffuse along the interface. In addition, this poor overlapping allowed contact between the nickel layer and the silver layer resulting in the development of an electrochemical corrosion cell. The main corrosion products that developed were silver sulfide (Ag2S) and nickel sulphur residue.

Static intercept ∗ technology: A new packaging platform for corrosion and ESD protection

Telecommunications providers expect products to perform reliably during operation in the field. Achieving the expected hardware reliability is due to an amalgamation of multiple factors. A significant contribution to reliable performance results from the incorporation of specific materials, which are very corrosion resistant and electrostatic discharge (ESD) safe during the design and manufacturing phases of the equipment life cycle. Environmental protection must be given to products to ensure that the products retain designed reliability during global storage and transport. There will be cases of material corrosion with as-received or stored products and there are many instances of “less than ideal” storage conditions for our products (e.g., customer warehouses without air-conditioning or environmental controls). We have developed a strategy to mitigate these problems by the use of a Static Intercept∗ packaging platform. This technology simultaneously protects equipment and components from corrosion, moisture, and ESD in a single packaging material for seven years or longer. The technical merits of Static Intercept, which currently provides the longest available protection against corrosion and ESD degradation, will be discussed in terms of addressing these storage issues.

Biased mixed flowing gas testing for world class reliability

The reliability of complex installed systems is a function of many variables, including those inherent in the operating environment. Recent changes in world market conditions and pressure for environmentally-friendly products require the rapid availability of reliability information for new products installed in stressful environments. The thorough evaluation of design reliability requires that accelerated testing incorporate as many real causes of failure as possible. Biased mixed flowing gas (BMFG) tests cover the most significant categories of stress variables inherent in real world operating conditions and are capable of simulating mass transport-dominated failure modes with near-linear acceleration in total mass transfer. This paper discusses the general and specific aspects of biased MFG testing of electronic systems and provides a case study of field failures illustrating the need for this type of testing as a regular part of system qualification.