John Steven Anderson

High-sensitivity 25-μm microbolometer FPAs

Raytheon Infrared Operations (RIO) has achieved a significant technical breakthrough in uncooled FPAs by reducing the pixel size by a factor of two while maintaining state-of-the-art sensitivity. Raytheon has produced the first high-quality 320x240 microbolometer FPAs with 25 micrometers pitch pixels. The 320 x240 FPAs have a sensitivity that is comparable to microbolometer FPAs with 50 micrometers pixels. The average NETD value for these FPAs is about 35 mK with an f/1 aperture and operating at 30 Hz frame rates. Good pixel operability and excellent image quality have been demonstrated. Pixel operability is greater than 99% on some FPAs, and uncorrected responsivity nonuniformity is less than 4% (sigma/mean). The microbolometer detectors also have a relatively fast thermal time constant of approximately 10 msec. This state-of-the-art performance has been achieved as a result of an advanced micromachining fabrication process. The process allows maximization of both the thermal isolation and the optical fill-factor. The reduction in pixel size offers several potential benefits for IR systems. For a given system resolution (IFOV) requirement, the 25 micrometers pixels allow a factor of two reduction in both the focal length and aperture size of the sensor optics. The pixel size reduction facilitates a significant FPA cost reduction since the number of die printed on a wafer can be increased. The pixel size reduction has enabled the development of a large-format 640x480 FPA array. Raytheon has produced arrays with very good sensitivity, operability, and excellent image quality. These FPAs are applicable to wide-field-of-view, long range surveillance and targeting missions. Raytheon is also developing a high performance 160x128 FPA that is designed for applications where miniaturization and temperature invariance are required as well as low cost and low power.

High-sensitivity (25-μm pitch) microbolometer FPAs and application development

Raytheon Infrared Operations (RIO) has achieved a significant technical breakthrough in uncooled FPAs by reducing the pixel size by a factor of two while maintaining state-of-the-art sensitivity. Raytheon has produced high-quality 320 X 240 microbolometer FPAs with 25 μm pitch pixels. The 320 X 240 FPAs have a sensitivity that is comparable to microbolometer FPAs with 50 micrometers pixels. The average NETD value for these FPAs is about 35 mK with an f/1 aperture and operating at 30 Hz frame rates. Good pixel operability and excellent image quality have been demonstrated. Pixel operability is greater than 99% on some FPAs, and uncorrected responsivity nonuniformity is less than 4% (sigma/mean). The microbolometer detectors also have a relatively fast thermal time constant of approximately 10 msec. This state-of-the-art performance has been achieved as a result of an advanced micromachining fabrication process. The process allows maximization of both the thermal isolation and the optical fill-factor. The reduction in pixel size offers several potential benefits for IR systems. For a given system resolution (IFOV) requirement, the 25 μm pixels allow a factor of two reduction in both the focal length and aperture size of the sensor optics. The pixel size reduction facilitates a significant FPA cost reduction since the number of die printed on a wafer can be increased. The pixel size reduction has enabled the development of a large-format 640 X 512 FPA array applicable to wide-field-of-view, long range surveillance and targeting missions, and a 160 X 128 array where applications for miniaturization and temperature invariance are required as well as low cost and low power.

Low-cost microsensors program

The objectives of the Low Cost Microsensors (LCMS) Program are twofold. The first is to develop and deliver a long-range infrared (IR) sensor built upon an uncooled vanadium oxide (VOx) 640 X 512 format focal plane array (FPA) engine. The second is to develop an expendable microsensor built upon a VOx 160 X 128 format FPA engine. The 640 X 480 sensor is applicable to long-range surveillance and targeting missions and is a reusable asset. The 160 X 120 sensor is designed for applications where miniaturization is required as well as low cost and low power. The 160 X 120 is also intended for expendable military applications. The intent of this DUS&T effort is to further reduce the cost, weight, and power of uncooled IR sensors, and to increase the capability of these sensors, thereby expanding their applicability to military and commercial markets never before addressed by thermal imaging.

High-sensitivity (25-μm pitch) microbolometer FPAs

RIO has achieved a significant technical breakthrough in uncooled FPAs by reducing the pixel size by a factor of two while maintaining state-of-the-art sensitivity. Raytheon has produced high-quality 320 by 240 micro bolometer FPAs with 25 micrometers pitch pixels. The 320 by 240 FPAs have a sensitivity that is comparable to micro bolometer FPAs with 50 micrometers pixels. The average NETD value for these FPAs is about 35 mK with an f/1 aperture and operating at 30 Hz frame rates. Good pixel operability and excellent image quality have been demonstrated. Pixel operability is greater than 99 percent on some FPAs, and uncorrected responsivity nonuniformity is less than 4 percent. The micro bolometer detectors also have a relatively fast thermal time constant of approximately 10 msec. This state-of-the-art performance has been achieved as a result of an advanced micromachining fabrication process. The process allows maximization of both the thermal isolation and the optical fill-factor. The reduction in pixel size offers several potential benefits for IR systems. For a given system resolution requirement, the 225 micrometers pixels allow a factor of two reduction in both the focal length and aperture size of the sensor optics. The pixel size reduction facilitates a significant FPA cost reduction since the number of die printed on a wafer can be increased. The pixel size reduction has enabled the development of a large-format 640 by 512 FPA array applicable to wide-field-of-view, long range surveillance and targeting missions, and a 160 by 128 array where applications for miniaturization and temperature invariance are required as well as low cost and low power.

Advances in uncooled systems applications

The Low Cost Microsensors (LCMS) Program recently demonstrated state-of-the-art imagery in a long-range infrared (IR) sensor built upon an uncooled vanadium oxide (VOx) 640 x 480 format focal plane array (FPA) engine. The 640 x 480 sensor is applicable to long-range surveillance and targeting missions. The intent of this DUS&T effort was to further reduce the cost, weight, and power of uncooled IR sensors, and to increase the capability of these sensors, thereby expanding their applicability to military and commercial markets never before addressed by thermal imaging. In addition, the Advanced Uncooled Thermal Imaging Sensors (AUTIS) Program extended this development to light-weight, compact unmanned aerial vehicle (UAV) applications.