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John W. Wood

Siemens Energy Sector

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Publication

Featured researches published by John W. Wood.

Archive | 2006

Seeding of HTC fillers to form dendritic structures

James D. B. Smith; Gary Stevens; John W. Wood

Archive | 2005

Compression of resin impregnated insulating tapes

James D. B. Smith; Gary Stevens; John W. Wood; Andreas Lutz

Archive | 2007

Patterning on surface with high thermal conductivity materials

James D. B. Smith; Gary Stevens; John W. Wood

Archive | 2005

Structured resin systems with high thermal conductivity fillers

James D. B. Smith; Gary Stevens; John W. Wood

Archive | 2012

High thermal conductivity materials aligned within resins

James D. B. Smith; Gary Stevens; John W. Wood

Archive | 2005

Surface coating of lapped insulation tape

James D. B. Smith; Gary Stevens; John W. Wood

Archive | 2006

Mix of grafted and non-grafted particles in a resin

James D. B. Smith; Gary Stevens; John W. Wood

Archive | 2006

Composite insulation tape with loaded HTC materials

James D. B. Smith; Gary Stevens; John W. Wood

Archive | 2007

Multi-layered platelet structure

Gary Stevens; James D. B. Smith; John W. Wood; Peter Groeppel

Archive | 2007

Treatment of micropores in mica materials

Gary Stevens; James D. B. Smith; John W. Wood

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James D. B. Smith

Westinghouse Electric

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