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Featured researches published by Jong-Kuk Hong.


electronic components and technology conference | 2007

Organic-Based RF Capacitors with Ceramic-Like Properties

Jin-Hyun Hwang; P.M. Raj; I.R. Abothu; Chong Yoon; Mahadevan K. Iyer; Hyung-Mi Jung; Jong-Kuk Hong; Rao Tummala

RF capacitor applications for filtering and signal matching need stringent tolerances in Temperature Coefficient of Capacitance (TCC) and Quality factor (Q). In this paper, the temperature dependence of the dielectric properties of polymer-ceramic composites was discussed, with particular emphasis on high Q polymers and paraelectric ceramic particles. This includes the important role of ceramic paraelectric particles such as A12O3, SiO2, Ta2O5 etc. as ceramic fillers and high Q polymers such as benzocyclobutene (BCB) in the development of high Q and low TCC dielectrics for embedded RF capacitors. High Q polymer by itself showed a negative TCC of about -250 ppm/ degC but the composite approach with A12O3, SiO2 and Ta2O5 fillers improved the TCC to -190, -130, +20 ppm/ degC , respectively, between temperatures ranging from room temperature to 125degC. Liquid coatable high Q polymer-based composites with 3-4X improvement in dielectric constant and nearly-zero TCC of approximately within plusmn30 ppm/degC were developed with Ta2O5 as the inorganic filler. This effect can be ascribed to the TCC compensation between negative TCC of high Q polymer and the positive TCC of paraelectric ceramic particle selected. The distribution of the particles in the polymer matrix is also a crucial aspect of this application.


Archive | 2004

PRINTED CIRCUIT BOARD INCLUDING EMBEDDED CAPACITOR HAVING HIGH DIELECTRIC CONSTANT AND METHOD OF FABRICATING SAME

Jin-yong Ahn; Chang-Sup Ryu; Suk-Hyeon Cho; Seok-Kyu Lee; Jong-Kuk Hong; Ho-Sik Jun


Archive | 2004

Method of fabricating PCB including embedded passive chip

Suk-Hyeon Cho; Seok-Kyu Lee; Jong-Kuk Hong; Ho-Sik Jun; Jin-soo Jeong; Chang-Sup Ryu; Jin-yong Ahn


Archive | 2008

Substrate manufacturing method

Jin-Yong An; Joon-Sung Kim; Jong-Kuk Hong; Chang-Sup Ryu


Archive | 2004

Method of producing printed circuit board with embedded resistor

Suk-Hyun Cho; Jang-Kyu Kang; Byung-Kook Sun; Jong-Kuk Hong; Seok-Kyu Lee; Jin-yong Ahn


Microelectronic Engineering | 2008

Temperature dependence of the dielectric properties of polymer composite based RF capacitors

Jin-Hyun Hwang; P. Markondeya Raj; I.R. Abothu; Chong Yoon; Mahadevan K. Iyer; Hyung-Mi Jung; Jong-Kuk Hong; Rao Tummala


Archive | 2008

Multilayered printed circuit board and fabricating method thereof

Jong-Kuk Hong; Jin-Yong An; Jae-Joon Lee


Archive | 2008

Method of manufacturing a package substrate

Jin-Yong An; Chang-Sup Ryu; Jong-Kuk Hong


Archive | 2008

Method of manufacturing a multi-layer board

Ki-Hwan Kim; Jong-Kuk Hong; Jin-Yong An


Archive | 2008

Multi-layer board and manufacturing method thereof

Ki-Hwan Kim; Jong-Kuk Hong; Jin-Yong An

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Jin-Yong An

Samsung Electro-Mechanics

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Chang-Sup Ryu

Samsung Electro-Mechanics

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Jin-yong Ahn

Samsung Electro-Mechanics

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Ki-Hwan Kim

Samsung Electro-Mechanics

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Seok-Kyu Lee

Samsung Electro-Mechanics

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Ho-Sik Jun

Samsung Electro-Mechanics

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Hyung-Mi Jung

Samsung Electro-Mechanics

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Suk-Hyeon Cho

Samsung Electro-Mechanics

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Chong Yoon

Georgia Institute of Technology

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I.R. Abothu

Georgia Institute of Technology

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