Jong Shik Chung
Pohang University of Science and Technology
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Publication
Featured researches published by Jong Shik Chung.
ACS Applied Materials & Interfaces | 2012
Cham Kim; Donghwan Kim; Hoyoung Kim; Jong Shik Chung
A binary BiTe nanocompound for thermoelectric applications was prepared via a water-based chemical reaction under atmospheric conditions. We attempted to increase the carrier mobility of the nanocompound by adopting a post-thermal treatment consisting of calcination and reduction at different temperatures. We also tried to control the carrier density of the compound by adjusting the stoichiometry of the atomic constituents. We measured other transport properties (i.e., electrical resistivity, Seebeck coefficient, and thermal conductivity) and observed how these properties were affected by both the carrier mobility and the carrier density. We derived the thermoelectric performance, as captured by the figure of merit (ZT), from the transport properties and discussed the effect of such properties on the ZT value. The nanocompound exhibited a very competent ZT value (0.91 at 100 °C), which is one of the best thermoelectric performances of chemically synthesized BiTe materials.
Materials Research Bulletin | 2009
Qiang Wang; Zhanhu Guo; Jong Shik Chung
Materials Research Bulletin | 2011
Cham Kim; Dong Hwan Kim; Yoon Soo Han; Jong Shik Chung; SangHa Park; Soonheum Park; Hoyoung Kim
Industrial & Engineering Chemistry Research | 2011
Qiang Wang; Jong Shik Chung; Zhanhu Guo
Powder Technology | 2011
Cham Kim; Dong Hwan Kim; Yoon Soo Han; Jong Shik Chung; SangHa Park; Hoyoung Kim
Journal of Alloys and Compounds | 2011
Cham Kim; Dong Hwan Kim; Jong Sook Kim; Yoon Soo Han; Jong Shik Chung; Hoyoung Kim
Industrial & Engineering Chemistry Research | 2010
Qiang Wang; Jiahua Zhu; Suying Wei; Jong Shik Chung; Zhanhu Guo
Journal of Alloys and Compounds | 2011
Cham Kim; Dong Hwan Kim; Yoon Soo Han; Jong Shik Chung; Hoyoung Kim
Science of Advanced Materials | 2011
Qiang Wang; Zipeng Xing; Weiwei Zhang; Zhanhu Guo; Jong Shik Chung
Chemical Communications | 2009
Qiang Wang; Zhanhu Guo; Jong Shik Chung