Jongseung Yoon

Omnidirectional printing of flexible, stretchable, and spanning silver microelectrodes.

Flexible, stretchable, and spanning microelectrodes that carry signals from one circuit element to another are needed for many emerging forms of electronic and optoelectronic devices. We have patterned silver microelectrodes by omnidirectional printing of concentrated nanoparticle inks in both uniform and high–aspect ratio motifs with minimum widths of approximately 2 micrometers onto semiconductor, plastic, and glass substrates. The patterned microelectrodes can withstand repeated bending and stretching to large levels of strain with minimal degradation of their electrical properties. With this approach, wire bonding to fragile three-dimensional devices and spanning interconnects for solar cell and light-emitting diode arrays are demonstrated.

Ultrathin silicon solar microcells for semitransparent, mechanically flexible and microconcentrator module designs

The high natural abundance of silicon, together with its excellent reliability and good efficiency in solar cells, suggest its continued use in production of solar energy, on massive scales, for the foreseeable future. Although organics, nanocrystals, nanowires and other new materials hold significant promise, many opportunities continue to exist for research into unconventional means of exploiting silicon in advanced photovoltaic systems. Here, we describe modules that use large-scale arrays of silicon solar microcells created from bulk wafers and integrated in diverse spatial layouts on foreign substrates by transfer printing. The resulting devices can offer useful features, including high degrees of mechanical flexibility, user-definable transparency and ultrathin-form-factor microconcentrator designs. Detailed studies of the processes for creating and manipulating such microcells, together with theoretical and experimental investigations of the electrical, mechanical and optical characteristics of several types of module that incorporate them, illuminate the key aspects.

Printed Assemblies of Inorganic Light-Emitting Diodes for Deformable and Semitransparent Displays

Bend Me, Stretch Me In the push toward flexible electronics, much research has focused on using organic conducting materials, including light-emitting diodes (LEDs), because they are more readily processed using scalable techniques. Park et al. (p. 977) have developed a series of techniques for depositing and assembling inorganic LEDs onto glass, plastic, or rubber. Conventional processing techniques are used to connect the LEDs in order to create flexible, stretchable displays, which, because the active diode material only covers a small part of the substrate, are mostly transparent. Methods to fabricate and assemble inorganic light-emitting diodes provide a route toward transparent, flexible, or stretchable display devices. We have developed methods for creating microscale inorganic light-emitting diodes (LEDs) and for assembling and interconnecting them into unusual display and lighting systems. The LEDs use specialized epitaxial semiconductor layers that allow delineation and release of large collections of ultrathin devices. Diverse shapes are possible, with dimensions from micrometers to millimeters, in either flat or “wavy” configurations. Printing-based assembly methods can deposit these devices on substrates of glass, plastic, or rubber, in arbitrary spatial layouts and over areas that can be much larger than those of the growth wafer. The thin geometries of these LEDs enable them to be interconnected by conventional planar processing techniques. Displays, lighting elements, and related systems formed in this manner can offer interesting mechanical and optical properties.

GaAs photovoltaics and optoelectronics using releasable multilayer epitaxial assemblies

Compound semiconductors like gallium arsenide (GaAs) provide advantages over silicon for many applications, owing to their direct bandgaps and high electron mobilities. Examples range from efficient photovoltaic devices to radio-frequency electronics and most forms of optoelectronics. However, growing large, high quality wafers of these materials, and intimately integrating them on silicon or amorphous substrates (such as glass or plastic) is expensive, which restricts their use. Here we describe materials and fabrication concepts that address many of these challenges, through the use of films of GaAs or AlGaAs grown in thick, multilayer epitaxial assemblies, then separated from each other and distributed on foreign substrates by printing. This method yields large quantities of high quality semiconductor material capable of device integration in large area formats, in a manner that also allows the wafer to be reused for additional growths. We demonstrate some capabilities of this approach with three different applications: GaAs-based metal semiconductor field effect transistors and logic gates on plates of glass, near-infrared imaging devices on wafers of silicon, and photovoltaic modules on sheets of plastic. These results illustrate the implementation of compound semiconductors such as GaAs in applications whose cost structures, formats, area coverages or modes of use are incompatible with conventional growth or integration strategies.

Stretchable GaAs Photovoltaics with Designs That Enable High Areal Coverage

Recent research in advanced materials and mechanics demonstrates the possibility for integrating inorganic semiconductors with soft, elastomeric substrates to yield systems with linear elastic mechanical responses to strains that signifi cantly exceed those associated with fracture limits of the constituent materials (e.g. ∼ 1% for many inorganics). This outcome can provide stretching to strain levels of tens of percent (in extreme cases, more than 100%), for diverse, reversible modes of deformation, including bending, twisting, stretching or compressing. [ 1–7 ]

Dynamically tunable hemispherical electronic eye camera system with adjustable zoom capability

Imaging systems that exploit arrays of photodetectors in curvilinear layouts are attractive due to their ability to match the strongly nonplanar image surfaces (i.e., Petzval surfaces) that form with simple lenses, thereby creating new design options. Recent work has yielded significant progress in the realization of such “eyeball” cameras, including examples of fully functional silicon devices capable of collecting realistic images. Although these systems provide advantages compared to those with conventional, planar designs, their fixed detector curvature renders them incompatible with changes in the Petzval surface that accompany variable zoom achieved with simple lenses. This paper describes a class of digital imaging device that overcomes this limitation, through the use of photodetector arrays on thin elastomeric membranes, capable of reversible deformation into hemispherical shapes with radii of curvature that can be adjusted dynamically, via hydraulics. Combining this type of detector with a similarly tunable, fluidic plano-convex lens yields a hemispherical camera with variable zoom and excellent imaging characteristics. Systematic experimental and theoretical studies of the mechanics and optics reveal all underlying principles of operation. This type of technology could be useful for night-vision surveillance, endoscopic imaging, and other areas that require compact cameras with simple zoom optics and wide-angle fields of view.

Flexible concentrator photovoltaics based on microscale silicon solar cells embedded in luminescent waveguides

Unconventional methods to exploit monocrystalline silicon and other established materials in photovoltaic (PV) systems can create new engineering opportunities, device capabilities and cost structures. Here we show a type of composite luminescent concentrator PV system that embeds large scale, interconnected arrays of microscale silicon solar cells in thin matrix layers doped with luminophores. Photons that strike cells directly generate power in the usual manner; those incident on the matrix launch wavelength-downconverted photons that reflect and waveguide into the sides and bottom surfaces of the cells to increase further their power output, by more than 300% in examples reported here. Unlike conventional luminescent photovoltaics, this unusual design can be implemented in ultrathin, mechanically bendable formats. Detailed studies of design considerations and fabrication aspects for such devices, using both experimental and computational approaches, provide quantitative descriptions of the underlying materials science and optics.

Performance of ultrathin silicon solar microcells with nanostructures of relief formed by soft imprint lithography for broad band absorption enhancement

Recently developed classes of monocrystalline silicon solar microcells can be assembled into modules with characteristics (i.e., mechanically flexible forms, compact concentrator designs, and high-voltage outputs) that would be impossible to achieve using conventional, wafer-based approaches. This paper presents experimental and computational studies of the optics of light absorption in ultrathin microcells that include nanoscale features of relief on their surfaces, formed by soft imprint lithography. Measurements on working devices with designs optimized for broad band trapping of incident light indicate good efficiencies in energy production even at thicknesses of just a few micrometers. These outcomes are relevant not only to the microcell technology described here but also to other photovoltaic systems that benefit from thin construction and efficient materials utilization.

Defect-mode mirrorless lasing in dye-doped organic/inorganic hybrid one-dimensional photonic crystal

We have developed a dye-doped organic/inorganic hybrid one-dimensional (1D) photonic crystal containing a dye-doped defect layer for defect-mode photonic band gap lasing. The multilayer laser structure consists of alternating layers of titania nanoparticles and polymethylmethacrylate (PMMA) with an active emission layer of organic dyes in PMMA. Low threshold lasing has been demonstrated at a single defect-mode wavelength of the 1D photonic band gap structure resulting from the inhibited density of states of photons within the stop band and the enhanced rates of spontaneous emission at the localized resonant defect mode.

Printable nanostructured silicon solar cells for high-performance, large-area flexible photovoltaics.

Nanostructured forms of crystalline silicon represent an attractive materials building block for photovoltaics due to their potential benefits to significantly reduce the consumption of active materials, relax the requirement of materials purity for high performance, and hence achieve greatly improved levelized cost of energy. Despite successful demonstrations for their concepts over the past decade, however, the practical application of nanostructured silicon solar cells for large-scale implementation has been hampered by many existing challenges associated with the consumption of the entire wafer or expensive source materials, difficulties to precisely control materials properties and doping characteristics, or restrictions on substrate materials and scalability. Here we present a highly integrable materials platform of nanostructured silicon solar cells that can overcome these limitations. Ultrathin silicon solar microcells integrated with engineered photonic nanostructures are fabricated directly from wafer-based source materials in configurations that can lower the materials cost and can be compatible with deterministic assembly procedures to allow programmable, large-scale distribution, unlimited choices of module substrates, as well as lightweight, mechanically compliant constructions. Systematic studies on optical and electrical properties, photovoltaic performance in experiments, as well as numerical modeling elucidate important design rules for nanoscale photon management with ultrathin, nanostructured silicon solar cells and their interconnected, mechanically flexible modules, where we demonstrate 12.4% solar-to-electric energy conversion efficiency for printed ultrathin (∼ 8 μm) nanostructured silicon solar cells when configured with near-optimal designs of rear-surface nanoposts, antireflection coating, and back-surface reflector.