José E. Spinelli

On array models theoretical predictions versus measurements for the growth of cells and dendrites in the transient solidification of binary alloys

Most of the theoretical studies of the growth of cells/dendrites in the literature are based on the assumption that it is a steady-state phenomenon. The analysis of cells/dendritic structures in the unsteady-state regime is very important, since it encompasses the majority of industrial solidification processes. The aim of the present investigation was to validate the predictions furnished by the cellular and primary dendritic growth models in the literature for unsteady-state conditions against a large spectrum of experimental data, which includes those for a variety of Al alloys (Al–Cu, Al–Si, Al–Fe, Al–Bi, Al–Ni, Al–Sn) and low thermal diffusivity alloys, such as Sn–Pb and Pb–Sb. The predictions furnished by the Hunt–Lu model do not match the cellular experimental scatter for any examined alloy system. However, this model matches well with the primary dendritic growth of Al alloys, with the exception of Al–Sn alloys, for which the Hunt–Thomas approach has to be applied. The primary dendritic predictions of Bouchard–Kirkaldys model, performed with the originally suggested a 1 calibration factors are, in most cases, located above the experimental points. Experimental growth laws relating cellular and dendritic spacings with the tip growth rate and the cooling rate, respectively, are established.

Growth direction and Si alloying affecting directionally solidified structures of Al–Cu–Si alloys

Abstract The roles of growth direction and Si content on the columnar/equiaxed transition and on dendritic spacings of Al–Cu–Si alloys still remain as an open field to be studied. In the present investigation, Al–6 wt-%Cu–4 wt-%Si and Al–6 wt-%Cu alloys were directionally solidified upwards and horizontally under transient heat flow conditions. The experimental results include tip growth rate and cooling rates, optical microscopy, scanning electron microscopy energy dispersive spectrometry and dendrite arm spacings. It was found that silicon alloying contributes to significant refinement of primary/secondary dendritic spacings for the upward configuration as compared with corresponding results of the horizontal growth. Experimental growth laws are proposed, and the effects of the presence/absence of solutal convection in both growth directions are discussed.

Assessment of Tertiary Dendritic Growth and Its Effects on Mechanical Properties of Directionally Solidified Sn-0.7Cu-xAg Solder Alloys

Although commercial SAC107/207/307 alloys are being used as alternatives to traditional Sn-Pb solder alloys, there is a lack of studies emphasizing some metallurgical aspects, for instance, the different morphologies of Cu6Sn5 and Ag3Sn intermetallic compounds (IMCs) as well as conditions for the launch of tertiary dendritic β-Sn branches and their effects on localized mechanical properties. A wide range of cooling rates during solidification is normally associated with quite different microstructural length parameters. Hence, Sn-0.7 wt.%Cu-x wt.%Ag (where x = 1.0, 2.0, and 3.0) alloys were directionally solidified under transient heat flow conditions, undergoing cooling rates varying from 0.1 K/s to 32.0 K/s. This experimental study encompasses: primary, secondary, and tertiary dendrite arm spacings (λ1, λ2, and λ3) associated with the evolution of the tip cooling rate (

Inter-relation of Microstructural Features and Dry Sliding Wear Behavior of Monotectic Al–Bi and Al–Pb Alloys

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Steady and unsteady state peritectic solidification

T˙) during solidification; start and growth of tertiary dendrite branches; yield (σy) and ultimate tensile strengths (σu); elongation to fracture (δ); and the morphology of IMCs embedded in the Sn-rich phase. A single ratio between the cooling rate (

Cooling thermal parameters, microstructural spacing and mechanical properties in a directionally solidified hypereutectic Al–Si alloy

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