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Dive into the research topics where Jose Saiz is active.

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Featured researches published by Jose Saiz.


Microelectronics Reliability | 2006

Temperature measurement on series resistance and devices in power packs based on on-state voltage drop monitoring at high current

X. Perpiñà; Jean-François Serviere; Jose Saiz; Davide Barlini; Michel Mermet-Guyennet; J. Millan

Based on the on-state voltage drop monitoring at high current, an alternative method for thermo-sensitive parameters calibration is reported. The main goal is that it allows the simultaneous calibration of the series resistance and power devices voltage drop on temperature. Thereby, the average temperature over all power devices and the temperature difference in average inside the pack can be measured in real applications.


european conference on power electronics and applications | 2007

Multi-domain simulation platform for virtual prototyping of integrated power systems.

P. Solomalala; Jose Saiz; A. Lafosse; Michel Mermet-Guyennet; Alberto Castellazzi; X. Chauffieur; J.-P. Fredin

Power electronics integration is a cross-disciplinary task. To develop reliable systems, a multi-domain physical approach is needed at all stages of the design. In the absence of well-established comprehensive solutions, simulation capability needs to be improved. This paper presents a novel technology integrated power assembly and discusses some manufacturability issues. It further proposes a virtual qualification platform in which all physics are treated with each specialist preferred simulation tool, coordinated by a custom-developed core section. A case-study demonstrates the validity of the envisaged solution.


Microelectronics Reliability | 2007

Virtual reliability assessment of integrated power switches based on multi-domain simulation approach

P. Solomalala; Jose Saiz; Michel Mermet-Guyennet; Alberto Castellazzi; Mauro Ciappa; X. Chauffleur; J. P. Fradin

To develop reliable integrated power electronics, it is paramount to consider the coupling between electrical, thermal and mechanical effects. Though essential for final validation, experimental analysis is time-consuming, especially when trying out new designs. Simulative approaches at multi-domain physical analysis need to be improved. In this work, a platform is proposed, in which all physics are treated with dedicated simulation programmes, co-ordinated by a custom-developed core section. A case study, based on a novel integrated power switch developed for railway traction applications, demonstrates the validity of the envisaged solution for virtual reliability assessment.


international symposium on power electronics, electrical drives, automation and motion | 2008

VHDL-AMS traction drive model including a 3D description of thermal effects

L. Vignaux; Jose Saiz; Alberto Castellazzi; Philippe Ladoux

This paper proposes the complete closed-loop model development of a railway traction drive, also taking into account the coupling between electrical and thermal effects. The work is based on VHDL-AMS and consists of four sections: the first deals with the compact model development of the asynchronous motor and its corresponding control sequence; the second is devoted to the DC/AC converter with PWM driving sequence and including an analytical description of the switching and conduction losses of the switches (IGBT-diode pairs); the third part presents the modeling of thermal aspects, which relies on a distributed 3D description of the semiconductor devices and their package, and, finally, those three parts are interconnected with each other inside the control loop. The resulting overall model is ideal for simulations of the traction drive over realistic mission profiles.


european conference on power electronics and applications | 2007

High temperature behaviours of aluminium nitride

Selim Dagdag; Thierry Lebey; S Dinculescu; Jose Saiz; Emmanuel Dutarde

One of the most attractive ways to increase power handling capability in power modules is to increase the operating temperature. Aluminium nitride based ceramics are claimed to be the ideal candidates to be used as substrates. However, depending on the elaboration process a decrease of the AlN dielectric strength may be observed. These results are discussed in the following paper.


Archive | 2004

Power switching module and inverter equipped therewith

Nathalie Martin; Benoit Boursat; Emmanuel Dutarde; Jose Saiz; Jacques Cettour-Rose; Pierre Solomalala


Integrated Power Systems (CIPS), 2008 5th International Conference on | 2008

3D Integration of Power Semiconductor Devices based on Surface Bump Technology

Michel Mermet-Guyennet; Alberto Castellazzi; Philippe Lasserre; Jose Saiz


Archive | 2001

Substrate for an electronic circuit, and an electronic module using such a substrate

Benoit Boursat; Emmanuel Dutarde; Luc Meysenc; Jose Saiz; Pierre Solomalala


Archive | 2002

Substrate for an electronic power circuit, and an electronic power module using such a substrate

Benoit Boursat; Emmanuel Dutarde; Nathalie Martin; Pierre Solomalala; Jose Saiz


Archive | 2013

ELECTRIC RAILROAD NETWORK AND ASSOCIATED ENERGY EXCHANGE PROCESS

Robert Periot; Jose Saiz; Dominique Jamet

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