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Dive into the research topics where Joseph A. Swift is active.

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Featured researches published by Joseph A. Swift.


IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A | 1998

An investigation of the contact behavior of electric distributed filament contacts

Jingsong Xie; Michael Pecht; Joseph A. Swift; Stanley J. Wallace

The findings of a preliminary experimental investigation into the contact behavior of nonmetallic, distributed filament contacts (DFCs) are reported. The study was designed to probe the effects of numerous fibrous micro-contacts upon the electro-mechanical behaviors of composite contacts and to compare the resultant behaviors with conventional metal contacts. Four composite materials, representing the variables of interest to this study, were processed into electrical contacts by two novel manufacturing methods. Static and dynamic tests reveal that DFC contact resistances can saturate at a level of as low as 10 g, and that DFC contact stability is, similar to that of metals, dependent upon the contact loads and the contact surface hardness, but nearly independent of the properties of the carbon fibers. The results suggest that it is possible to tailor DFC electro-mechanical characteristics over a range that is not possible with monolithic contact materials by the judicious selection of matrix resin, fiber loading, and surface microstructures.


IEEE Transactions on Components and Packaging Technologies | 2007

Carbon Fiber-Based Grid Array Interconnects

Yuliang Deng; Michael Pecht; Joseph A. Swift; Stanley J. Wallace

This paper presents a new type of grid array electrical interconnect that uses carbon fiber as the conductive medium. Characterization of the electrical properties suggest that carbon fiber-based interconnects can be applied across different packaging levels, such as semiconductor die to substrate, integrated circuit package-to-board and board-to-board interconnections. Multiple interconnect contacts have been integrated to provide multiple interconnections within a single assembly. Each interconnect contact consists of a large number of carbon fibers which can act cooperatively to provide a high degree of reliability and predictability to the interconnect function. An optional metal coating, such as nickel, copper, aluminum or gold, can be applied over the carbon fibers to enhance conductivity and solderability. These novel interconnects can be joined to conventional circuitry by several techniques including pressure/physical contact, solder, and conductive adhesives (U.S. Patent 007 220 131).


Journal of Electronic Packaging | 1999

A Statistical Mechanical Model of Electrical Carbon Fiber Contacts

Jingsong Xie; Michael Pecht; Abhijit Dasgupta; Joseph A. Swift; Stanley J. Wallace

This paper presents a model for electrical carbon fiber contacts. In the model, a statistically distributed fiber length was considered at contact surfaces. A technique of dealing with this kind of contact surfaces with statistically determined, or specifically undeterminable, geometry was developed. The results were compared with the experimental data obtained previously. Also, the contact behaviors of electrical carbon fiber contacts were discussed and some specific contact properties, which were also observed experimentally, were clarified. A contact resistance decreasing rate was defined in a logarithmic-logarithmic scale coordinate. A constant-rate contact region was identified. The objective of this research is to provide a theoretical basis for the contact surface designs of electrical connectors.


Surface Science | 2002

Practical surfaces: beyond the wheel

Santokh S. Badesha; Joseph A. Swift

In this paper, we explore the challenges of designing practical surfaces for the 21st century. By building upon examples from different industries, we derive a number of useful tenets intended to guide those who face these challenges through the maze of technical and economic issues that they may confront. Given that future opportunities abound for surfaces having new and better properties, we describe some emerging materials systems that are likely to yield these improvements.


Polymer | 1978

Metal catalysed oxidative coupling of mercaptan-containing poly(dimethyl siloxanes)

Donald A. Seanor; Joseph A. Swift

Abstract The oxidative coupling of mercaptan-containing poly(dimethyl siloxane) polymers: catalysed by different metals has been studied. In the presence of excess oxygen, the kinetics obey the law, d(SH) d t = −k( SH ) n , where n = 0 or 2 dependent upon temperature and the specific metal. The rate constant, k, is independent of x and y in the range studied but is a function of the metal. An activation energy of 18.4 ± 0.6 kcal/mol was found. It is postulated that the following sequence of reactions occurs: Depending upon the metal and temperature, desorption (step 3) or reaction (step 2) may be the ratelimiting step. Steps (3) and (4) may occur simultaneously. Metals for which no oxidation/reduction couple exists show little catalytic effect even though a strongly bonded interfacial layer is formed. The interfacial layer which formed rapidly was studied via reflection spectroscopy and protective ability. It is strongly bonded, of low critical surface energy and consists primarily of: However, it is enriched in sulphur over the bulk polymer.


Archive | 1987

Electrostatic charging and cleaning brushes

Joseph A. Swift


Archive | 2000

Puzzle-cut on puzzle-cut seamed belts

Constance J. Thornton; T. Edwin Freeman; Theodore Lovallo; Edward L. Schlueter; Joseph A. Swift; Xiaoying Elizabeth Yuan


Archive | 1988

Electrically insulating polymer matrix with conductive path formed in situ

Arthur J. Epstein; Joan R. Ewing; Joseph A. Swift


Archive | 1993

Fibrillated pultruded electronic components and static eliminator devices

Joseph A. Swift; Thomas E. Orlowski; Stanley J. Wallace; Wilbur M. Peck; John E. Courtney; David E. Rollins


Archive | 1990

PROCESS FOR CATALYSIS OF ELECTROLESS METAL PLATING ON PLASTIC

Thomas E. Orlowski; James M. Duff; Joan R. Ewing; Joseph A. Swift; Raymond E. Bailey

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