Joseph Alfred Iannotti

Design and Development of a Package Using LCP for RF/Microwave MEMS Switches

We present the development of an ultrahigh moisture-resistant enclosure for RF microelectromechanical system (MEMS) switches using liquid-crystal polymer (LCP). A cavity formed in LCP has been laminated, at low temperature, onto a silicon MEMS switch to create a package. The LCP-cap package has an insertion loss of less than 0.2 dB at X-band. E595 outgas tests demonstrate that the LCP material is suitable for constructing reliable packages without interfering with the operation of the MEMS switch. The package also passes Method 1014, MIL-STD-883 gross leak, and fine leak hermeticity tests

Multilayer Organic Multichip Module Implementing Hybrid Microelectromechanical Systems

We present the design and development of an organic package that is compatible with fully released RF microelectromechanical systems (MEMS). The multilayer organic package consists of a liquid-crystal polymer film to provide near hermetic cavities for MEMS. The stack is further built up using organic thin-film polyimide. To demonstrate the organic package, we have designed and implemented a 2-bit true-time delay X-band phase shifter using commercially available microelectromechanical switches. The packaged phase shifter has a measured insertion loss of 2.45 plusmn 0.12 dB/bit at 10 GHz. The worst case phase variation of the phase shifter at 10 GHz is measured to less than 5deg. We have also conducted temperature cycling (-65degC to 150degC) and 85/85 to qualify the packaging structures.

Integration of 50-GHz traveling-wave amplifier and polymer Mach-Zehnder device using flexible substrate technology

We present the results for a 50GHz drive amplifier for use with a Mach-Zehnder modulator. The MMIC device is packaged using a flexible substrate technology to obtain compact size and broadband performance. The packaged device exhibits well-matched transmission lines on the input and output, and large gain and bandwidth. The MMIC performance is directly related to performance of the drain bias circuit.

50-GHz drive amplifier for integration with polymer Mach-Zehnder device

We present the results for a 50GHz drive amplifier for use with a Mach-Zehnder modulator. The MMIC device is packaged using a flexible substrate technology to obtain compact size and broadband performance. The packaged device exhibits well-matched transmission lines on the input and output, and large gain and bandwidth. The MMIC performance is directly related to performance of the drain bias circuit.