Joseph Fernandez

Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor

Integrated circuit package having interchip bonding and method therefor

A single-sided package including an integrated circuit semiconductor chip and inductive coil and method therefor

Stress reducing lead-frame for plastic encapsulation

Apparatus and method for removing semiconductor chips from a diced semiconductor wafer

Connecting a plurality of bond pads and/or inner leads with a single bond wire

Open cavity plastic package

Single die stitch bonding

Method for reducing die cracking in integrated circuits

Arrangement and method of arrangement of stacked dice in an integrated electronic device