Jung-Hong Min

Thin Ni film on graphene current spreading layer for GaN-based blue and ultra-violet light-emitting diodes

We introduced a thin nickel (Ni) film onto graphene as a current spreading layer for GaN-based blue and ultraviolet (UV) light emitting diodes (LEDs). The thin Ni film was confirmed to improve the electrical properties of the graphene by reducing the sheet and contact resistances. The advantages of Ni on graphene were more remarkable in UV LEDs, in which the operation voltage was reduced from 13.2 V for graphene alone to 7.1 V. As a result, UV LEDs with Ni on graphene showed a uniform and reliable light emission, at ∼83% of electroluminescence of indium tin oxide.

Graphene interlayer for current spreading enhancement by engineering of barrier height in GaN-based light-emitting diodes

Pristine graphene and a graphene interlayer inserted between indium tin oxide (ITO) and p-GaN have been analyzed and compared with ITO, which is a typical current spreading layer in lateral GaN LEDs. Beyond a certain current injection, the pristine graphene current spreading layer (CSL) malfunctioned due to Joule heat that originated from the high sheet resistance and low work function of the CSL. However, by combining the graphene and the ITO to improve the sheet resistance, it was found to be possible to solve the malfunctioning phenomenon. Moreover, the light output power of an LED with a graphene interlayer was stronger than that of an LED using ITO or graphene CSL. We were able to identify that the improvement originated from the enhanced current spreading by inspecting the contact and conducting the simulation.

Morphology Evolution of Pulsed-Flux Ga-Polar GaN Nanorod Growth by Metal Organic Vapor Phase Epitaxy and Its Nucleation Dependence

We fabricated selectively grown Ga-polar GaN nanorods by optimizing metal organic vapor phase epitaxy (MOVPE) growth parameters using continuous- and pulsed-mode approaches. Nucleation layers were grown using continuous mode with H2 or N2 as carrier gas, which resulted in pyramidal or hexagonal shapes, respectively. The growth mechanism of nanorods was further studied for the nucleation layer grown with the H2 case, in which the pyramidal shape of the nucleation layer was observed to be flattened during the initial step of pulsed-mode growth and then evolved into nanorods by Ga clustering on the top c-plane.

Fabrication of a vertically-stacked passive-matrix micro-LED array structure for a dual color display

We report a color tunable display consisting of two passive-matrix micro-LED array chips. The device has combined vertically stacked blue and green passive-matrix LED array chips sandwiched by a transparent bonding material. We demonstrate that vertically stacked blue and green micro-pixels are independently controllable with operation of four color modes. Moreover, the color of each pixel is tunable in the entire wavelength from the blue to green region (450 nm - 540 nm) by applying pulse-width-modulation bias voltage. This study is meaningful in that a dual color micro-LED array with a vertically stacked subpixel structure is realized.

Monolithic integration of AlGaInP-based red and InGaN-based green LEDs via adhesive bonding for multicolor emission

In general, to realize full color, inorganic light-emitting diodes (LEDs) are diced from respective red-green-blue (RGB) wafers consisting of inorganic crystalline semiconductors. Although this conventional method can realize full color, it is limited when applied to microdisplays requiring high resolution. Designing a structure emitting various colors by integrating both AlGaInP-based and InGaN-based LEDs onto one substrate could be a solution to achieve full color with high resolution. Herein, we introduce adhesive bonding and a chemical wet etching process to monolithically integrate two materials with different bandgap energies for green and red light emission. We successfully transferred AlGaInP-based red LED film onto InGaN-based green LEDs without any cracks or void areas and then separated the green and red subpixel LEDs in a lateral direction; the dual color LEDs integrated by the bonding technique were tunable from the green to red color regions (530–630 nm) as intended. In addition, we studied vertically stacked subpixel LEDs by deeply analyzing their light absorption and the interaction between the top and bottom pixels to achieve ultra-high resolution.

Ag-mesh-combined graphene for an indium-free current spreading layer in near-ultraviolet light-emitting diodes

We have designed and fabricated Ag-mesh-combined graphene current spreading layers (CSLs) for GaN-based near-ultraviolet light-emitting diodes (NUV LEDs). Three different types of the CSLs were fabricated having 300 μm, 150 μm, and 75 μm gaps between the mesh lines. Optical and electrical properties were investigated and the performance of the LEDs having the CSLs and were compared with those of LEDs having indium tin oxide and graphene CSLs. The light output power of the LEDs with the Ag-mesh-combined graphene CSL adopting 150 μm-gap was highest at both the same current injection and at the same input power. This was possible due to the lowering of the sheet resistance via the adoption of an Ag mesh and the networking of the Ag mesh using a graphene sheet with very little transmittance loss.

Quantification of effective thermal conductivity in the annealing process of Cu2ZnSn(S,Se)4 solar cells with 9.7% efficiency fabricated by magnetron sputtering

Cu2ZnSn(S,Se)4 (CZTSSe) has attracted much attention as the absorption layer of photovoltaic devices because of its appropriate bandgap energy and low cost. However, CZTSSe solar cells have so far shown low power conversion efficiency compared to other solar cells and studies are being conducted to improve it. In this study, we achieved an improvement in the shunt resistance and power conversion efficiency (PCE) of CZTSSe solar cells with quantification of the effective thermal conductivity. A CZTSSe solar cell fabricated using a graphite box designed with high thermal conductivity exhibited a high shunt resistance of 413 Ω cm2 and a fill factor of 63.8%, and additionally, secondary phases such as Cu2S/Se and CuS/Se were not detected. On the other hand, a CZTSSe solar cell fabricated using a graphite box with low thermal conductivity showed a rougher surface and low shunt resistance mainly related to secondary phase formation. As a result, a PCE of 9.72% was achieved using a graphite box designed with high thermal conductivity.

High-performance metal mesh/graphene hybrid films using prime-location and metal-doped graphene

We introduce high-performance metal mesh/graphene hybrid transparent conductive layers (TCLs) using prime-location and metal-doped graphene in near-ultraviolet light-emitting diodes (NUV LEDs). Despite the transparency and sheet resistance values being similar for hybrid TCLs, there were huge differences in the NUV LEDs’ electrical and optical properties depending on the location of the graphene layer. We achieved better physical stability and current spreading when the graphene layer was located beneath the metal mesh, in direct contact with the p-GaN layer. We further improved the contact properties by adding a very thin Au mesh between the thick Ag mesh and the graphene layer to produce a dual-layered metal mesh. The Au mesh effectively doped the graphene layer to create a p-type electrode. Using Raman spectra, work function variations, and the transfer length method (TLM), we verified the effect of doping the graphene layer after depositing a very thin metal layer on the graphene layers. From our results, we suggest that the nature of the contact is an important criterion for improving the electrical and optical performance of hybrid TCLs, and the method of doping graphene layers provides new opportunities for solving contact issues in other semiconductor devices.

Very thin ITO/metal mesh hybrid films for a high-performance transparent conductive layer in GaN-based light-emitting diodes

In this paper, we introduce very thin Indium tin oxide (ITO) layers (5, 10, and 15 nm) hybridized with a metal mesh to produce high-performance transparent conductive layers (TCLs) in near-ultraviolet light-emitting diodes (NUV LEDs). Using UV-vis-IR spectrometry, Hall measurement, and atomic force microscopy, we found that 10 nm was the optimal thickness for the very thin ITO layers in terms of outstanding transmittance and sheet resistance values as well as stable contact properties when hybridized with the metal mesh. The proposed layers showed a value of 4.56 Ω/□ for sheet resistance and a value of 89.1% for transmittance. Moreover, the NUV LEDs fabricated with the hybrid TCLs achieved ∼140% enhanced light output power compared to that of 150 nm thick ITO layers. Finally, to verify the practical usage of the TCLs for industrial applications, we packaged the NUV LED chips and obtained improved turn-on voltage (3.48 V) and light output power (∼116%) performance.

Size-controlled InGaN/GaN nanorod LEDs with an ITO/graphene transparent layer

We introduce ITO on graphene as a current-spreading layer for separated InGaN/GaN nanorod LEDs for the purpose of passivation-free and high light-extraction efficiency. Transferred graphene on InGaN/GaN nanorods effectively blocks the diffusion of ITO atoms to nanorods, facilitating the production of transparent ITO/graphene contact on parallel-nanorod LEDs, without filling the air gaps, like a bridge structure. The ITO/graphene layer sufficiently spreads current in a lateral direction, resulting in uniform and reliable light emission observed from the whole area of the top surface. Using KOH treatment, we reduce series resistance and reverse leakage current in nanorod LEDs by recovering the plasma-damaged region. We also control the size of the nanorods by varying the KOH treatment time and observe strain relaxation via blueshift in electroluminescence. As a result, bridge-structured LEDs with 8 min of KOH treatment show 15 times higher light-emitting efficiency than with 2 min of KOH treatment.