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Jung-Huei Peng

TSMC

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Publication

Featured researches published by Jung-Huei Peng.

Archive | 2013

MEMS DEVICE AND METHOD OF FORMING THE SAME

Yu-Chia Liu; Chia-Hua Chu; Jung-Huei Peng; Kuei-Sung Chang; Chun-Wen Cheng

Archive | 2014

Wafer level packaging bond

Martin Liu; Richard Chu; Hung Hua Lin; Hsin-Ting Huang; Jung-Huei Peng; Yuan-Chih Hsieh; Lan-Lin Chao; Chun-Wen Cheng; Chia-Shiung Tsai

Archive | 2010

METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PACKAGING

Jung-Huei Peng; Hsin-Ting Huang; Yao-Te Huang; Shang-Ying Tsai; Ping-Yin Liu

Archive | 2010

MEMS Devices and Methods of Fabrication Thereof

Jung-Huei Peng; Chun-Ren Cheng; Jiou-Kang Lee; Shang-Ying Tsai; Ting-Hau Wu

Archive | 2011

Method for reducing chip warpage

Ting-Hau Wu; Chun-Ren Cheng; Jiou-Kang Lee; Shang-Ying Tsai; Jung-Huei Peng

Archive | 2014

Package systems and manufacturing methods thereof

Chia-Pao Shu; Chun-Wen Cheng; Kuei-Sung Chang; Hsin-Ting Huang; Shang-Ying Tsai; Jung-Huei Peng

Archive | 2013

MEMS DEVICE AND METHOD OF FORMATION THEREOF

Hsin-Ting Huang; Jung-Huei Peng; Shang-Ying Tsai; Yao-Te Huang; Ming-Tung Wu; Ping-Yin Liu; Xin-Hua Huang; Yuan-Chih Hsieh

Archive | 2013

Triple-Axis MEMS Accelerometer

Ting-Hau Wu; Chun-Ren Cheng; Shang-Ying Tsai; Jiou-Kang Lee; Jung-Huei Peng

Archive | 2011

Method of fabricating a semiconductor device having recessed bonding site

Hsin-Ting Huang; Jung-Huei Peng; Shang-Ying Tsai; Yao-Te Huang; Ming-Tung Wu; Ping-Yin Liu; Xin-Hua Huang; Yuan-Chih Hsieh

Archive | 2010

Self-removal anti-stiction coating for bonding process

Ping-Yin Liu; Li-Cheng Chu; Hung-Hua Lin; Shang-Ying Tsai; Yuan-Chih Hsieh; Jung-Huei Peng; Lan-Lin Chao; Chia-Shiung Tsai; Chun-Wen Cheng

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Collaboration

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Shang-Ying Tsai

TSMC

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Chun-Wen Cheng

TSMC

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Chun-Ren Cheng

TSMC

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Jiou-Kang Lee

TSMC

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Ting-Hau Wu

TSMC

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Yao-Te Huang

TSMC

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Chia-Hua Chu

TSMC

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Hsin-Ting Huang

TSMC

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Yi-Chuan Teng

TSMC

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Chin-Yi Cho

TSMC

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