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Dive into the research topics where Junichi Kimura is active.

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Featured researches published by Junichi Kimura.


IEEE Transactions on Components, Packaging and Manufacturing Technology | 2013

Analytical Design Method for a Low-Distortion Microwave InGaP/GaAs HBT Amplifier Based on Transient Thermal Behavior in a GaAs Substrate

Ryo Ishikawa; Junichi Kimura; Kazuhiko Honjo

Based on the transient thermal behavior in a GaAs substrate, the distortion caused by the self-heating effect in an InGaP/GaAs heterojunction bipolar transistor (HBT) has been analytically compensated. The temperature-time variation in a transistor depends on the thermal characteristics of a semiconductor substrate at the base-band range. For a wideband digital modulated signal as input, a multistage thermal resistor-thermal capacitor ladder circuit is used as a model to emulate the thermal characteristics. The distortion analysis is based on Taylor and Volterra series expansion techniques including both electrical and thermal effects. In addition, a compensation condition for the distortion caused by the thermal influence is also successfully derived based on distortion analysis. The validity of the proposed analytical method is shown for an InGaP/GaAs HBT power amplifier operating at 1.95 GHz. The analytical design results are in good agreement with the measured results.


Archive | 2007

Method of manufacturing module

Takayuki Hiruma; Misao Kanba; Junichi Kimura; Motoyoshi Kitagawa; Masahisa Nakaguchi; Tomohide Ogura; 昌久 中口; 元祥 北川; 智英 小倉; 潤一 木村; 操 神庭; 孝之 蛭間


Archive | 2006

Component-embedded printed wiring board and method of manufacturing the same

Kazuhiko Honjo; Toshihiko Mori; Eiji Kawamoto; Junichi Kimura; Motoyoshi Kitagawa


IEICE Transactions on Electronics | 2010

Distortion Compensation for Thermal Memory Effect on InGaP/GaAs HBT Amplifier by Inserting RC-Ladder Circuit in Base Bias Circuit

Ryo Ishikawa; Junichi Kimura; Yukio Takahashi; Kazuhiko Honjo


asia-pacific microwave conference | 2011

Analytic parameter determination for thermal memory effect compensation circuit in microwave InGaP/GaAs HBT power amplifiers

Ryo Ishikawa; Junichi Kimura; Kazuhiko Honjo


Archive | 2012

Resin-sealed substrate device and method of manufacturing the same

Junichi Kimura; Motoyoshi Kitagawa; 元祥 北川; 潤一 木村


Archive | 2010

Flexible module provided with power generating device, and flexible sensor device provided with power generating device using the flexible module

Kazuhiko Sueoka; 末岡一彦; Toshiaki Nakamura; 中村俊昭; Sanae Asayama; 浅山早苗; Naoki Yuda; 湯田直毅; Motoyoshi Kitagawa; 北川元祥; Junichi Kimura; 木村潤一


Archive | 2010

COMPONENT-EMBEDDED PRINTED WIRING BOARD

Kazuhiko Honjo; Toshihiko Mori; Eiji Kawamoto; Junichi Kimura; Motoyoshi Kitagawa


Archive | 2006

SUBSTRATE INCORPORATING COMPONENT AND ITS MANUFACTURING METHOD

Kazuhiko Honjo; Eiji Kawamoto; Junichi Kimura; Motoyoshi Kitagawa; Toshihiko Mori; 元祥 北川; 英司 川本; 潤一 木村; 和彦 本城; 敏彦 森


Archive | 2013

Land mine disposal device

潤一 木村; Junichi Kimura; 田中 亙; Wataru Tanaka; 亙 田中

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Kazuhiko Honjo

University of Electro-Communications

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Ryo Ishikawa

University of Electro-Communications

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