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Kambhampati Ramakrishna

STATS ChipPAC Ltd

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Publication

Featured researches published by Kambhampati Ramakrishna.

Archive | 2006

Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides

Marcos Karnezos; Il Kwon Shim; Byung Joon Han; Kambhampati Ramakrishna; Seng Guan Chow

Archive | 2006

Semiconductor assembly including chip scale package and second substrate and having exposed substrate surfaces on upper and lower sides

Marcos Karnezos; Il Kwon Shim; Byung Joon Han; Kambhampati Ramakrishna; Seng Guan Chow

Archive | 2006

Method of mounting an integrated circuit package in an encapsulant cavity

Il Kwon Shim; Byung Joon Han; Kambhampati Ramakrishna; Seng Guan Chow

Archive | 2006

Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides

Marcos Karnezos; Il Kwon Shim; Byung Joon Han; Kambhampati Ramakrishna; Seng Guan Chow

Archive | 2006

PRE-MOLDED LEADFRAME AND METHOD THEREFOR

Il Kwon Shim; Diane Sahakian; Kambhampati Ramakrishna; Seng Guan Chow

Archive | 2012

Dual molded multi-chip package system

Kambhampati Ramakrishna; Il Kwon Shim; Seng Guan Chow

Archive | 2008

Integrated circuit package system with flexible substrate and mounded package

Seng Guan Chow; Il Kwon Shim; Byung Joon Han; Kambhampati Ramakrishna

Archive | 2007

Stacked semiconductor packages and method therefor

Kambhampati Ramakrishna; Il Kwon Shim; Seng Guan Chow

Archive | 2010

Encapsulant cavity integrated circuit package system and method of fabrication thereof

Il Kwon Shim; Byung Joon Han; Kambhampati Ramakrishna; Seng Guan Chow

Archive | 2008

Integrated circuit package system with an encapsulant cavity and method of fabrication thereof

Il Kwon Shim; Byung Joon Han; Kambhampati Ramakrishna; Seng Guan Chow

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Collaboration

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Il Kwon Shim

STATS ChipPAC Ltd

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Seng Guan Chow

STATS ChipPAC Ltd

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Byung Joon Han

STATS ChipPAC Ltd

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Marcos Karnezos

STATS ChipPAC Ltd

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Diane Sahakian

STATS ChipPAC Ltd

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