Kamila Piotrowska

Thermal decomposition of solder flux activators under simulated wave soldering conditions

Purpose The aim of this work is to investigate the decomposition behaviour of the activator species commonly used in the wave solder no-clean flux systems and to estimate the residue amount left after subjecting the samples to simulated wave soldering conditions. Design/methodology/approach Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid-base titration method as a function of temperature, time of exposure and the substrate material used. Findings The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL-malic). The decomposition patterns of solder flux activators depend on their chemical nature, time of heat exposure and substrate materials. Evaporation of the residue from the surface of different materials (laminate with solder mask, copper surface or glass surface) was found to be more pronounced for succinic-based solutions at highest test temperatures than for adipic acid. Less left residue was found on the laminate surface with solder mask (∼5-20 per cent of initial amount at 350°C) and poorest acid evaporation was noted for glass substrates (∼15-90 per cent). Practical implications The findings are attributed to the chemistry of WOAs typically used as solder flux activators. The results show the importance WOA type in relation to its melting/boiling points and the impact on the residual amount of contamination left after soldering process. Originality/value The results show that the evaporation of the flux residues takes place only at significantly high temperatures and longer exposure times are needed compared to the temperature range used for the wave soldering process. The extended time of thermal treatment and careful choice of fluxing technology would ensure obtaining more climatically reliable product.

Parametric Study of Solder Flux Hygroscopicity: Impact of Weak Organic Acids on Water Layer Formation and Corrosion of Electronics

The presence of solder flux residues on the printed circuit board assembly surface is an important factor contributing to humidity-related reliability issues that affect device lifetime. This investigation focuses on understanding the hygroscopic nature of typical wave solder flux activators—weak organic acids—under varied temperature conditions. In situ x-ray diffraction measurements assessed the effect of high temperature on the crystal structure of organic activators. The hygroscopicity studies were carried out under relative humidity (RH) levels varying from 30% to ∼ 99% and at temperatures 25°C, 40°C, and 60°C. Water absorption levels were determined using the gravimetric method, and the influence on reliability was assessed using electrochemical impedance and leak current measurements performed on the surface insulation resistance comb patterns. The corrosion studies were correlated with the hygroscopicity results and solubility data. Corrosion morphology was analysed using the optical microscopy and scanning electron microscopy. The results show that the hygroscopic nature of typical solder flux residue depends on its chemical structure and temperature. An increase of temperature shifts the critical RH level for water vapour absorption towards lower RH range, accelerating the formation of a conductive electrolyte and the occurrence of ion transport-induced electrochemical migration. The overall ranking of flux activators with the increasing order of aggressivity is: palmitic < suberic  < adipic < succinic < glutaric < dl-malic acid.