Katrin Persson

LTCC interconnects in microsystems

Different microelectromechanical system (MEMS) packaging strategies towards high packaging density of MEMS devices and lower expenditure exist both in the market and in research. For example, electrical interconnections and low stress wafer level packaging are essential for improving device performance. Hybrid integration of low temperature co-fired ceramics (LTCC) with Si can be a way for an easier packaging system with integrated electrical interconnection, and as well towards lower costs. Our research on LTCC-Si integration is reported in this paper.

Microreplication in a silicon processing compatible polymer material

We present a novel fabrication process for the integration of polymer micro-optical elements on silicon. The process relies on a reverse order protocol based on embossing in an amorphous fluorocarbon polymer, Cytoptrade

Ceramic Micro Heater Technology for Gas Sensors

The paper presents the design and manufacturing steps of micro heaters, built on ceramic suspended membranes for gas sensor applications. The micro heaters are designed and fabricated by combining laser milling techniques, and conductive ceramic technology. Trenches are created in the ceramic substrate in order to define the geometry of the heater using laser processing of the substrate. The heater is completed by filling the trenches with conductive ceramic paste and then baking to remove the solvent from the paste. The final step involves releasing the membrane by laser milling, enabling it to be suspended on four bridges, to minimise the dissipation of the heat in the substrate. The temperature of the heater element was measured with a heat camera from FLIR 40 system comparing the case of the heater positioned on top of a released membrane and that of the non-released membrane. The simulation of the heater build on top of a released membrane was compared with the heater measurements

Methods for characterization of wafer-level encapsulation applied on silicon to LTCC anodic bonding

This paper presents initial results on generic characterization methods for wafer-level encapsulation. The methods, developed specifically to evaluate anodic bonding of low-temperature cofired ceramics (LTCC) to Si, are generally applicable to wafer-level encapsulation. Different microelectromechanical system (MEMS) structures positioned over the whole wafer provide local information about the bond quality. The structures include (i) resonating cantilevers as pressure sensors for bond hermeticity, (ii) resonating bridges as stress sensors for measuring the stress induced by the bonding and (iii) frames/mesas for pull tests. These MEMS structures have been designed, fabricated and characterized indicating that local information can easily be obtained. Buried electrodes to enable localized bonding have been implemented and their effectiveness is indicated from first results of the novel Si to LTCC anodic bonding.

Design and manufacturing of micro heaters for gas sensors

Abstract The paper presents the design and manufacturing steps of micro heaters, built on ceramic suspended membranes for gas sensor applications. The micro heaters are designed and fabricated by combining laser milling techniques, and conductive ceramic technology. Trenches are created in the ceramic substrate in order to define the geometry of the heater using laser processing of the substrate. The heater is completed by filling the trenches with conductive ceramic paste and then baking to remove the solvent from the paste. The final step involves releasing the membrane by laser milling, enabling it to be suspended on four bridges, to minimise the dissipation of the heat in the substrate. The temperature of the heater element was measured with a heat camera from FLIR 40 system comparing the case of the heater positioned on top of a released membrane and that of the non-released membrane. The simulation of the heater build on top of a released membrane was compared with the heater measurements.

Chemoresistive gas sensor manufacturing using mixed technologies

The paper presents the development of a novel suspended membrane resistive gas sensor on a ceramic substrate. The sensor is designed and simulated to be fabricated by combining laser milling techniques, conductive ceramic technology, thin film technology, and semiconductor metal oxides. Trenches are created in the alumina substrate in order to define the geometry of the heater using laser processing of the substrate. The heater is completed by filling the trenches with conductive ceramic paste and then baking to remove the solvent from the paste. The next step consists of polishing the surface to obtain a surface roughness small enough for thin film technology. A dielectric (SiO/sub 2/ or ceramic) material is then deposited, acting as hot plate and also as electrical isolation between the heater and sensing electrode. The sensing electrode consists of an interdigitated resistor made of Au or Pt with thickness in the range of 2000-3000 /spl Aring/. The gas sensitive layer (SnO/sub 2/) is deposited by screen printing or spinning. When heated it react with gas molecules and changes its resistivity, thereby acting as a sensor. The final step involves releasing the sensor, enabling it to be suspended on four bridges, to minimise the dissipation of the heat in the substrate.