Katsumi Miyama
Hokkaido University of Science
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Publication
Featured researches published by Katsumi Miyama.
international conference on electronics packaging | 2017
Katsumi Miyama; Yoshihisa Katoh
The displacement and stress-strain distribution of a device-embedded substrate under bending stress was simulated using the finite element method (FEM). In addition, the capacitance change of embedded devices was measured experimentally using an actual TEG substrate under bending stress. The results of the FEM analysis indicated that tensile stress at the surface of an embedded device may be a cause of electrical property changes. They may be affected by the substrate construction, especially the existence of a surface-mounted device. From the results of measuring the capacitance of an embedded chip capacitor with applied bending stress, the capacitance value increased relative to the stress. It was presumed that the distance between the electrodes of a laminated ceramic capacitor was narrowed slightly by the bending stress, which caused the capacitance increase.
Archive | 2003
Tomoyasu Gunji; Katsumi Miyama; Katsuhito Nakagawa; Masaru Ogasawara; Takashi Oyama; Takeshi Sunada; Noriyuki Ubusawa; 勝仁 中川; 勝 小笠原; 貴史 尾山; 敬之 生澤; 砂田 剛; 克己 見山; 智康 郡司
international conference on electronic packaging and imaps all asia conference | 2015
Katsumi Miyama; Kanou Yoshida; Shigeru Saitou; Toshiyuki Takashima
Materials Transactions | 2011
Shigeru Saito; Toshiyuki Takashima; Katsumi Miyama; Kazuya Kurokawa; Toshio Narita
Journal of The Japan Institute of Metals | 1996
Katsumi Miyama; Masaya Ito; Toshio Narita
Materials Transactions | 2012
Shigeru Saito; Toshiyuki Takashima; Katsumi Miyama; Kazuya Kurokawa; Toshio Narita
Archive | 1992
Masaya Ito; Katsumi Miyama; Toshio Narita; 正也 伊藤; 敏夫 成田; 克己 見山
Transactions of The Japan Institute of Electronics Packaging | 2017
Katsumi Miyama; Yoshihisa Katoh
The Proceedings of Mechanical Engineering Congress, Japan | 2017
Atsuya Toba; Hayato Suzuki; Shigeki Hirano; Katsumi Miyama; Tadashi Takeda; Shun Hashizume
The Proceedings of Mechanical Engineering Congress, Japan | 2017
Hayato Suzuki; Atsuya Toba; Katsumi Miyama