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Keng Hung Lin

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Publication

Featured researches published by Keng Hung Lin.

Archive | 2012

Solder Bump Bonding In Semiconductor Package Using Solder Balls Having High-Temperature Cores

Richard K. Williams; Keng Hung Lin

Archive | 2007

Pillar Bump Package Technology

Richard K. Williams; Allen K. Lam; Keng Hung Lin

Archive | 2015

Low-Profile Footed Power Package

Richard K. Williams; Keng Hung Lin

Archive | 2015

Sinusoidal drive system and method for phototherapy

Richard K. Williams; Keng Hung Lin; Daniel Schell; Joseph P. Leahy

Archive | 2011

Bump-On-Leadframe Semiconductor Package With Low Thermal Resistance

Richard K. Williams; Keng Hung Lin

Archive | 2017

Universal Surface-Mount Semiconductor Package

Richard K. Williams; Keng Hung Lin

Archive | 2017

3D Bendable Printed Circuit Board With Redundant Interconnections

Richard K. Williams; Keng Hung Lin

Archive | 2014

Flexible LED LIght Pad For Phototherapy

Richard K. Williams; Keng Hung Lin; Yu-Min Lin; Daniel Schell; Joseph P. Leahy

Archive | 2011

Integrated circuit die with low thermal resistance

Richard K. Williams; Keng Hung Lin

Archive | 2017

Method Of Fabricating Low-Profile Footed Power Package

Richard K. Williams; Keng Hung Lin

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Collaboration

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