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Kenichi Kamiyama

Hitachi

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Archive | 2009

Formation method of metal layer on resin layer, printed wiring board, and production method thereof

Kenji Takai; Norio Moriike; Kenichi Kamiyama; Kiyoshi Hasegawa

Archive | 2009

Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board

Kenji Takai; Norio Moriike; Kenichi Kamiyama; Takako Watanabe; Shin Takanezawa; Koji Morita; Kiyoshi Hasegawa

Archive | 2004

Method of forming insulating resin layer on metal, method of treating internal conductor circuit, method of manufacturing printed wiring board, and multilayered wiring board

Kiyoshi Hasegawa; Kenichi Kamiyama; Michio Moriike; Kenji Takai; 健一 上山; 克之 増田; 教夫 森池; 清 長谷川; 健次 高井

Archive | 2007

Substrate for mounting semiconductor element with stress relaxation layer and its manufacturing method

Kenichi Kamiyama; Nobuyuki Ogawa; Hitoshi Onozeki; Takahiro Tanabe; 健一 上山; 信之 小川; 仁 小野関; 貴弘 田邉

Archive | 2004

Printed circuit board having adhesion auxiliary layer between insulating layers and manufacturing method thereof

Kenichi Kamiyama; Michio Moriike; Koji Morita; Kenji Takai; Shin Takanezawa; Takako Watanabe; 建一 上山; 克之 増田; 教夫 森池; 高示 森田; 貴子 渡▲辺▼; 健次 高井; 伸 高根沢

Archive | 2008

METHOD OF FORMING INSULATING RESIN LAYER ON METAL

Kiyoshi Hasegawa; Kenichi Kamiyama; Michio Moriike; Kenji Takai; 健一 上山; 克之 増田; 教夫 森池; 清 長谷川; 健次 高井

Archive | 2007

Adhesive film for circuit board, circuit board using the same, circuit board for mounting semiconductor chip and semiconductor package

Kenichi Kamiyama; Masaharu Matsuura; Nobuyuki Ogawa; Konatsu Yamada; 健一 上山; 信之 小川; 小夏 山田; 雅晴 松浦

Archive | 2004

Multi-layer wiring board and its manufacturing method

Kiyoshi Hasegawa; Kenichi Kamiyama; Michio Moriike; Kenji Takai; 健一 上山; 克之 増田; 教夫 森池; 清 長谷川; 健次 高井

Archive | 2003

Laminate plate and multilayer printed circuit board using it and these manufacturing method

Kiyoshi Hasegawa; Kenichi Kamiyama; Michio Moriike; Kenji Takai; 健一 上山; 教夫 森池; 清 長谷川; 健次 高井

Archive | 2008

Internal layer conductor circuit treatment method

Kiyoshi Hasegawa; Kenichi Kamiyama; Michio Moriike; Kenji Takai; 健一 上山; 克之 増田; 教夫 森池; 清 長谷川; 健次 高井

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