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Kenji Masumoto

Texas Instruments

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Publication

Featured researches published by Kenji Masumoto.

Archive | 2000

Semiconductor package, semiconductor device, electronic device, and method for producing semiconductor package

Takanao Suzuki; Tadanori Ominato; Masahiro Kaizu; Akihito Kurosaka; Masatoshi Inaba; Nobuyuki Sadakata; Mutsumi Masumoto; Kenji Masumoto

Archive | 2009

Substrate structure for cavity package

Kenji Masumoto; Masazumi Amagai; Masayuki Yoshino; Yukio Moriyama

Archive | 1992

Method of manufacturing resin-encapsulated semiconductor device package using photoresist or pre-peg lead frame dam bars

Kenji Masumoto; Takashi Nakashima

Archive | 2003

Method of manufacturing a semiconductor chip comprising multiple bonding pads in staggard rows on edges

Kenji Masumoto; Mutsumi Masumoto; Akira Karashima

Archive | 2009

Copper pillar bonding for fine pitch flip chip devices

Kenji Masumoto; Mutsumi Masumoto

Archive | 2001

Back side coating of semiconductor wafers

Sreenivasan K. Koduri; Kenji Masumoto; Mutsumi Masumoto

Archive | 2000

Semiconductor chip mounting method utilizing ultrasonic vibrations

Tomohiro Okazaki; Kenji Masumoto; Mutsumi Masumoto; Katsumi Yamaguchi

Archive | 2003

Semiconductor package, semiconductor device and electronic device

Takanao Suzuki; Tadanori Ominato; Masahiro Kaizu; Akihito Kurosaka; Masatoshi Inaba; Nobuyuki Sadakata; Mutsumi Masumoto; Kenji Masumoto

Archive | 2004

Integrated circuit structure having a flip-chip mounted photoreceiver

Kenji Masumoto

Archive | 1990

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE PACKAGE WITH NONCONDUCTIVE TAPE EMBEDDED BETWEEN OUTER LEAD PORTIONS

Kenji Masumoto; Takashi Nakashima

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Collaboration

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Mutsumi Masumoto

Texas Instruments

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Nobuyuki Sadakata

Texas Instruments

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Akihito Kurosaka

Fujikura

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Masahiro Kaizu

Fujikura

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Masatoshi Inaba

Fujikura

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Masazumi Amagai

Texas Instruments

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Tadanori Ominato

Fujikura

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Takanao Suzuki

Fujikura

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Takashi Nakashima

Texas Instruments

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Masatoshi Inaba

Fujikura

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