Kentaro Tatsukoshi

Development of Through Glass Via (TGV) formation technology using electrical discharging for 2.5/3D integrated packaging

This study explored Through Glass Via (TGV) Formation Technology by using Focused Electrical Discharging Method for alkali-fee glass which has well matched CTE with Si. 2.5D/3D Packaging has presently attracted lots of attention, an interposer is recognized as one of key materials, and its development of new fine pitch, high dense, and low cost interposer are accelerated. Glass is expected as one of candidates as a substrate material of future interposer substrate. This study demonstrates TGV formation showed capabilities of fine pitch and high dense, and TGV formation for standard thick glass aiming varied applications for packaging such as MEMS, Optical device, and RF device. This study discussed further challenges related to metalization technique and carrying methods for glass interposer. Necessary future development and subjects were pointed out.

TGV technology for Glass interposer

This study explored glass microfabrication technologies for TGV (Through Glass Via) formation can be applied interposer substrate of 3D packaging. Two TGV formation methods were studied and compared such as optical approach using Excimer laser and electrical approach using focused electrical discharging. Demonstration of laser microfabrication showed the result of 40um pitch of TGVs which is able to be fine pitch solution. And demonstration of focused electrical discharging method showed the result of ultrafast TGV process with 75um pitch. In this study, we compared characteristic of both technologies and pointed necessary future development for glass interposer application.