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Kessler Angela

Infineon Technologies

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Publication

Featured researches published by Kessler Angela.

Archive | 2010

Verfahren zur Herstellung eines Halbleitermoduls mit zwei Substraten

Bauer Michael; Kessler Angela; Schober Wolfgang; Haimerl Alfred; Mahler Joachim

Archive | 2006

Thermoplast-Duroplast-Verbund und Verfahren zum Verbinden eines thermoplastischen Materials mit einem duroplastischen Material

Mahler Joachim; Haimerl Alfred; Schober Wolfgang; Bauer Michael; Kessler Angela

Archive | 2006

Semiconductor sensor component comprises a cavity container and components arranged in a cavity of container, which exhibit a sensor chip with a sensor range, where cavity container exhibits opening and sensor range is turned to opening

Bauer Michael; Kessler Angela; Schober Wolfgang; Mahler Joachim; Haimerl Alfred

Archive | 2005

Semiconductor component with at least one semiconductor chip and covering compound, and methods for the production thereof

Bauer Michael; Haimerl Alfred; Kessler Angela; Mahler Joachim; Schober Wolfgang

Archive | 2015

Halbleiterbauelement mit mehreren Halbleiterchips und einem Laminat

Scharf Thorsten; Palm Petteri; Kessler Angela

Archive | 2007

Leistungshalbleiterbauteil in Flachleitertechnik mit vertikalem Strompfad

Bauer Michael; Kessler Angela; Schober Wolfgang; Haimerl Alfred; Mahler Joachim

Archive | 2017

Umleiten von Lotmaterial zu einer visuell prüfbaren Packungsoberfläche

Kessler Angela; Plikat Boris; Scharf Thorsten; Syri Erich; Palm Petteri; Schnoy Fabian; Otremba Ralf; Schiess Klaus; Häberlen Liver; Kutschak Matteo-Alessandro

Archive | 2017

Redirecting solder material to visually inspectable package surface

Kessler Angela; Haeberlen Oliver; Kutschak Matteo-Alessandro; Otremba Ralf; Palm Petteri; Plikat Boris; Scharf Thorsten; Schiess Klaus; Schnoy Fabian; Syri Erich

Archive | 2016

Leiterplatte mit eingebettetem Leistungshalbleiterchip

Gruber Martin; Kessler Angela; Scharf Thorsten

Archive | 2014

Chipgehäuse, Chipanordnungen, eine Leiterplatte und Verfahren zur Herstellung von Chipgehäusen

Bauer Michael; Haimerl Alfred; Kessler Angela; Schober Wolfgang

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Haimerl Alfred

Infineon Technologies

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Mahler Joachim

Infineon Technologies

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Schober Wolfgang

Infineon Technologies

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Bauer Michael

Infineon Technologies

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Scharf Thorsten

Infineon Technologies

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Palm Petteri

Infineon Technologies

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Kutschak Matteo-Alessandro

Infineon Technologies

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Otremba Ralf

Infineon Technologies

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Plikat Boris

Infineon Technologies

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Schiess Klaus

Infineon Technologies

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