Kevin Kruse

Optical-electrical printed wiring board for high-speed computing applications

Abstract. Optical-electrical printed wiring boards were fabricated featuring mechanical transfer (MT)-compatible interconnections for out-of-plane optical signal routing with an average optical link loss of 10.7 dB. Commercially available components were integrated into an optical layer for out-of-plane optical routing, including light turning devices that feature spherical micro lens arrays, a total internal reflection mirror, and alignment slots compatible with standard MT connectors. The feasibility of the optical-electrical printed wiring board is discussed in detail to demonstrate its compatibility with common printed circuit board manufacturing processes. The optical-electrical printed wiring board prototypes survived thermal cycling (−40°C to 85°C) and humidity exposure (95% humidity) showing an overall degradation of <3  dB of optical performance. Operational failure (>18  dB) occurred after environmental aging life testing at 110°C for 216 h.

Chemical inertness of UV-cured optical elastomers within the printed circuit board manufacturing process for embedded waveguide applications

Embedding polymer optical waveguides (WGs) into printed circuit boards (PCBs) for intra-board or board-to-board high speed data communications requires polymer materials that are compatible and inert when exposed to common PCB manufacturing processes. Ensuring both WG functionality after chemical exposure and maintaining PCB manufacturing integrities within the production process is crucial for successful implementation. The PCB manufacturing flow is analyzed to expose major requirements that would be required for the successful implementation of polymer materials for embedded WG development. Chemical testing and analysis were performed on Dow Corning ® OE-4140 UV-Cured Optical Elastomer Core and Dow Corning® OE-4141 UV-Cured Optical Elastomer Cladding which are designed for low loss embedded optical WGs. Contamination testing was conducted to demonstrate polymer compatibility in both cured and uncured form. Various PCB chemicals were treated with uncured polymer material and tested for effective contamination. Fully polymerized multimode WGs were fabricated and exposed to PCB chemicals at temperatures and durations comparable to PCB manufacturing conditions. Chemical analysis shows that the chosen polymer is compatible and inert with most common PCB manufacturing processes.

Fan-out routing and optical splitting techniques for compact optical interconnects using single-mode polymer waveguides

Polymer waveguide (WG) S-bends are necessary for fan-out routing techniques and optical splitting in high-density optical interconnects. Designing and manufacturing of optimal S-bends are critical for minimizing optical link loss while maintaining overall size and layout constraints. Complete structural loss analysis is demonstrated theoretically and shown experimentally utilizing both radial and transitional loss in single-mode (SM) polymer WG radial arc, cosine, and raised-sine S-bend profiles. SM polymer WG straights were first fabricated to measure standard propagation loss. SM WG S-bends were fabricated incorporating straight lead-in and lead-out sections to incorporate transitional loss present in workable designs. S-bend designs were measured at different dimensions and matched to theoretical losses. Compact cosine and radial arc S-bends exhibited the lowest structure loss for low and high NA WGs, respectively. High-speed performance of SM WG straights and S-bends was measured at 10 Gbit/s demonstrating low error rate. Optical splitters designed with S-bends and tapers were also evaluated and fabricated. Trade-off between optimal loss and minimal device size is discussed.

Using the 3D beam propagation method to model the effects of lithographic roughness on the attenuation of highly multimodal polymer waveguides

Waveguide sidewall surface roughness is a primary cause of attenuation in lithographically defined, multimode, polymer optical waveguides. Techniques that are currently employed to analyze the effect of roughness on highly multimode waveguides such as coupled mode theory are not easily adaptable to more complicated structures. For example, this technique cannot be used for waveguides that utilize bends, where the modal distribution can not be easily calculated. In this paper, the beam propagation method is used to find sidewall roughness losses empirically. Straight waveguides of different roughnesses are first modeled, and the modeled results are compared to the attenuation of manufactured straight waveguides. The roughness that closely matches the manufactured waveguides attenuation is then verified further by matching the attenuation of waveguides containing 90° bends.

Optical waveguide end roughness in correlation to optical coupling

With the ever-increasing demand for board-to-board optical data communications, the correlation between waveguide surface end roughness and coupling losses must be thoroughly investigated. This study measures end roughness of siloxane polymer optical waveguides in terms of optical coupling losses. Siloxane Polymers from Dow Corning were used to fabricate 50 x 50 μm rectangular waveguides through photolithographic processes. Edge roughness was controlled through various grades of fiber-optic polishing films and then measured using interferometric microscopy (IFM). Controlled lab results are compared with industrial polishing techniques that are consistent with mass-production methods. Electromagnetic modeling revealed correlations between experimental and theoretical results.

Laser-written polymer waveguides for embedded printed circuit board computing applications

Integrating polymer optical waveguides (WGs) for board-to-board high speed data communications require prototyping samples for proof-of-concept studies before moving to large scale production. A laser direct writing (LDW) method is shown as a cost savings alternative to photolithographic prototyping large substrate samples. The LDW setup consists of a 3-axis high-precision motion platform with a commercially available UV laser diode coupled to a lens-capped single mode fiber. The correlation between writing parameters and the resulting waveguide dimensions is discussed theoretically and confirmed experimentally with Dow Corning® OE-4140 UV-Cured Optical Elastomer Core and Dow Corning® OE-4141 UV-Cured Optical Elastomer Cladding for both multimode and single-mode feasibility. Laser written waveguide radial bends and crossings are also evaluated to show manufacturing capabilities for advanced prototyping designs. Polymer waveguides fabricated with the LDW method are experimentally validated with losses comparable to polymer waveguides manufactured with the photolithographic process (< 0.05 dB/cm).

Three-dimensional patterning in polymer optical waveguides using focused ion beam milling

Abstract. Waveguide (WG) photonic-bridge taper modules are designed for symmetric planar coupling between silicon WGs and single-mode fibers (SMFs) to minimize photonic chip and packaging footprint requirements with improving broadband functionality. Micromachined fabrication and evaluation of polymer WG tapers utilizing high-resolution focused ion beam (FIB) milling is performed and presented. Polymer etch rates utilizing the FIB and optimal methods for milling polymer tapers are identified for three-dimensional patterning. Polymer WG tapers with low sidewall roughness are manufactured utilizing FIB milling and optically tested for fabrication loss. FIB platforms utilize a focused beam of ions (Ga+) to etch submicron patterns into substrates. Fabricating low-loss polymer WG taper prototypes with the FIB before moving on to mass-production techniques provides theoretical understanding of the polymer taper and its feasibility for connectorization devices between silicon WGs and SMFs.

Silicone polymer waveguide bridge for Si to glass optical fibers

Multimode step index polymer waveguides achieve high-speed, (<10 Gb/s) low bit-error-rates for onboard and embedded circuit applications. Using several multimode waveguides in parallel enables overall capacity to reach beyond 100 Gb/s, but the intrinsic bandwidth limitations due to intermodal dispersion limit the data transmission rates within multimode waveguides. Single mode waveguides, where intermodal dispersion is not present, have the potential to further improve data transmission rates. Single mode waveguide size is significantly less than their multimode counterparts allowing for greater density of channels leading to higher bandwidth capacity per layer. Challenges in implementation of embedded single mode waveguides within printed circuit boards involves mass production fabrication techniques to create precision dimensional waveguides, precision alignment tolerances necessary to launch a mode, and effective coupling between adjoining waveguides and devices. An emerging need in which single mode waveguides can be utilized is providing low loss fan out techniques and coupling between on-chip transceiver devices containing Si waveguide structures to traditional single mode optical fiber. A polymer waveguide bridge for Si to glass optical fibers can be implemented using silicone polymers at 1310 nm. Fabricated and measured prototype devices with modeling and simulation analysis are reported for a 12 member 1-D tapered PWG. Recommendations and designs are generated with performance factors such as numerical aperture and alignment tolerances.

Laser direct writing of complex radially varying single-mode polymer waveguide structures

Abstract. Increasing board-to-board and chip-to-chip computational data rates beyond 12.5 Gbs will require the use of single-mode polymer waveguides (WGs) that have high bandwidths and are able to be wavelength division multiplexed. Laser direct writing (LDW) of polymer WGs provides a scalable and reconfigurable maskless procedure compared to common photolithography fabrication. LDW of straights and radial curves are readily achieved using predefined drive commands of the two-axis direct drive linear stage system. Using the laser direct write process for advanced WG structures requires stage-drive programming techniques that account for specified polymer material exposure durations. Creating advanced structures such as WG S-bends into single-mode polymer WG builds provides designers with the ability to affect pitch control, optical coupling, and reduce footprint requirements. Fabrication of single-mode polymer WG segmented radial arcs is achieved through a smooth radial arc user-programmed defined mathematical algorithm. Cosine and raised-sine S-bends are realized through a segmentation method where the optimal incremental step length and bend dimensions are controlled to achieve minimal structure loss. Laser direct written S-bends are compared with previously published photolithographic S-bend results using theoretical bend loss models. Fabrication results show that LDW is a viable method in the fabrication of advanced polymer WG structures.

Holography demonstrations and workshops for science and engineering outreach

The SPIE/OSA Student Chapter at Michigan Technological University have developed demonstrations and workshops for science and engineering outreach. The practical approach to holography promotes the study of photonic related sciences in high school and college-aged students. An introduction to laser safety, optical laboratory practices, and basic laser coherence theory is given in order to first introduce the participants to the science behind the holograms. The students are then able to create a hologram of an item of their choice, personalizing the experience. By engaging directly, the students are able to see how the theory is applied and also enforces a higher level of attention from them so no mistakes are made in their hologram. Throughout the course participants gain an appreciation for photonics by learning how holograms operate and are constructed through hands on creation of their own holograms. This paper reviews the procedures and methods used in the demonstrations and workshop while examining the overall student experience.