Kida Akinari | Researchain

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Archive | 2000

Manufacture of wiring board

Tsubomatsu Yoshiaki; Fukutomi Naoki; Kida Akinari; Yasuoka Takuya

Archive | 2000

Semiconductor device, semiconductor device substrate, and methods of fabricating the same

Yamazaki Toshio; Fukutomi Naoki; Suzuki Kazuhisa; Morita Hiroshi; Wakashima Yoshiaki; Naoyuki Susumu; Kida Akinari

Archive | 1981

Method of manufacturing multilayer printed circuit board substrate

Iwasaki Yorio; Fukutomi Naoki; Kida Akinari

Archive | 1981

MANUFACTURE OF INSULATING SUBSTRATE CONTAINING METALLIC CORE

Iwasaki Yorio; Fukutomi Naoki; Kida Akinari

Archive | 1998

ADHESIVE FILM FOR PRINTED CIRCUIT BOARD

Takahashi Atsushi; Yamamoto Kazunori; Ogi Shinji; Morita Kouji; Nanaumi Ken; Hirozawa Kiyoshi; Hirayama Takao; Hirakura Hiroaki; Ito Toshihiko; Kida Akinari

Archive | 1996

Manufacture of multilayered wiring board with terminal

Ogino Haruo; Tsuyama Koichi; Nakaso Akishi; Otsuka Kazuhisa; Kida Akinari; Tamura Yoshihiro

Archive | 1982

Method of producing metal core-filled insulating substrate

Iwasaki Yorio; Fukutomi Naoki; Kida Akinari; Kojima Fujio

Archive | 1996

MANUFACTURING METHOD OF LAMINATED BOARD FOR MULTILAYER PRINTED-WIRING BOARD

Yamamoto Kazunori; Takahashi Atsushi; Ogi Shinji; Kamishiro Yasushi; Suzunaga Atsushi; Kida Akinari; Ikeda Kenichi; Tanaka Katsuhiko; Suzuki Takayuki; Tanaka Masashi

Archive | 1993