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Dive into the research topics where King Owyang is active.

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Featured researches published by King Owyang.


IEEE Transactions on Electron Devices | 1986

Lateral HVIC with 1200-V bipolar and field-effect devices

Mike Chang; George Charles Pifer; Hamza Yilmaz; E. J. Wildi; Robert George Hodgins; King Owyang; M. S. Adler

The 1200-V blocking capability of lateral high-voltage devices has been achieved through theoretical and experimental investigation. The feasibility of a 1200-V lateral n-p-n bipolar junction transistor, p-n diode, and lateral DMOSFET has been demonstrated for the first time. The on-resistance of the 1200-V DMOSFET is 4 times less than its 1200-V n-p-n BJT counterpart. The major contribution to high BJT on-resistance comes from the series JFET pinch resistance.


Microelectronics Reliability | 1984

Integrated circuit incorporating low voltage and high voltage semiconductor devices

Louis J. Ragonese; Nicholas A. Schmitz; Saverio F. Bevacqua; King Owyang

An integrated circuit incorporating high voltage semiconductor devices which are controlled by low voltage semiconductor devices is disclosed, including a method for making the same. The low voltage devices which are capable of realizing complex logic functions on the same chip are realized with only one simple extra step in the fabrication process as compared with the process used to fabricate discrete high voltage power transistors. The process addition to implant the low voltage device does not significantly degrade the original capability associated with discrete power transistors. Both laterally developed and vertically developed devices are described. The integrated circuit combines I2 L logic with power Darlington transistors. A large area ion implantation permits one to fabricate both low and high voltage devices on one substrate. The resulting integrated circuit permits a plurality of loads to be controlled by a simple or complex control function.


Archive | 1996

Surface mount and flip chip technology for total integrated circuit isolation

Mike F. Chang; King Owyang; Fwu-Iuan Hshieh; Yueh-Se Ho; Jowei Dun


Archive | 1996

Trenched DMOS transistor fabrication having thick termination region oxide

Fwu-Iuan Hshieh; Mike F. Chang; Yueh-Se Ho; King Owyang


Archive | 1996

Trenched DMOS transistor having thick field oxide in termination region

Fwu-Iuan Hshieh; Mike F. Chang; Yueh-Se Ho; King Owyang


Archive | 1996

Surface mount and flip chip technology with diamond film passivation for total integated circuit isolation

Mike F. Chang; King Owyang; Fwu-Iuan Hshieh; Yueh-Se Ho; Jowei Dun; Hans-Jürgen Füsser; Reinhard Zachai


Archive | 1995

Method of making a field effect trench transistor having lightly doped epitaxial region on the surface portion thereof

Mike F. Chang; Fwu-Iuan Hshieh; Sze-Hon Kwan; King Owyang


Archive | 1995

Trenched DMOS transistor fabrication using six masks

Sze-Hon Kwan; Fwu-Iuan Hshieh; Mike F. Chang; Yueh-Se Ho; King Owyang


Archive | 1993

Reverse battery protection device containing power MOSFET

Richard K. Williams; Thomas Toombs; King Owyang; Hamza Yilmaz


Archive | 1993

Structure and fabrication of power MOSFETs, including termination structures

Fwu-Iuan Hshieh; Mike Chang; Jun W. Chen; King Owyang; Dorman C. Pitzer; Jan Van Der Linde

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Mike Chang

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