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Kohei Takeda

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Publication

Featured researches published by Kohei Takeda.

Archive | 2008

Adhesive for electronic components

Hideaki Ishizawa; Akinobu Hayakawa; Kohei Takeda

Archive | 2011

Adhesive for bonding electronic parts

Akinobu Hayakawa; Hideaki Ishizawa; Ryohei Masui; Kohei Takeda; 良平 増井; 明伸 早川; 英亮 石澤; 幸平 竹田

Archive | 2009

Adhesive for electronic part

Akinobu Hayakawa; Hideaki Ishizawa; Ryohei Masui; Kohei Takeda; 良平 増井; 明伸 早川; 英亮 石澤; 幸平 竹田

Archive | 2008

ADHESIVE FOR JOINING ELECTRONIC PART

Akinobu Hayakawa; Hideaki Ishizawa; Kohei Takeda; 明伸 早川; 英亮 石澤; 幸平 竹田

Archive | 2009

Adhesive for electronic component, semiconductor chip stacking method, and semiconductor device

Hideaki Ishizawa; Akinobu Hayakawa; Kohei Takeda

Archive | 2008

Semiconductor chip laminate and manufacturing method thereof

Akinobu Hayakawa; Hideaki Ishizawa; Kohei Takeda; 明伸 早川; 英亮 石澤; 幸平 竹田

Archive | 2010

METHOD FO PRODUCING SEMICONDUCTOR CHIP STACK, AND SEMICONDUCTOR DEVICE

Akinobu Hayakawa; Hideaki Ishizawa; Kohei Takeda; Ryohei Masui

Archive | 2010

Adhesive for bonding semiconductor chip

Akinobu Hayakawa; Hideaki Ishizawa; Chizuru Kin; Ryohei Masui; Kohei Takeda; 良平 増井; 明伸 早川; 英亮 石澤; 幸平 竹田; 千鶴 金

Archive | 2006

Display control unit, control method thereof, information reproducing unit, and electronic equipment

Kohei Takeda; 幸平 竹田

Archive | 2008

Adhesive for electrical part

Akinobu Hayakawa; Hideaki Ishizawa; Kohei Takeda; 明伸 早川; 英亮 石澤; 幸平 竹田

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Akinobu Hayakawa

Kyoto University

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