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Dive into the research topics where Koichi Miyake is active.

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Featured researches published by Koichi Miyake.


Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2000

Processing, microstructure, and properties of ternary high-strength Cu–Cr–Ag in situ composites

Dierk Raabe; Koichi Miyake; Hidefusa Takahara

A new class of ternary in situ metal matrix composites (MMCs) with high strength and high electrical conductivity consisting of heavily co-deformed Cu, Cr, and Ag is introduced. Three alloys are investigated in detail, namely, Cu‐10wt.%Cr‐3wt.%Ag, Cu‐10wt.%Cr‐1wt.%Ag, and Cu‐4.5wt.%Cr‐3wt.%Ag. The alloys were produced by inductive melting and chill casting. Because Cu‐Cr and Cu‐Cr‐Ag alloys with hypereutectic Cr content are less ductile than previously investigated Cu‐Nb, Cu‐Ag, and Cu‐Nb‐Ag alloys, special attention was placed on optimizing microstructure with respect to both strength and ductility using thermal and thermo-mechanical processing schemes. These included various combinations of swaging, heavy wire deformation (using different lubricants), solution annealing at different temperatures followed by quenching, and aging at different temperatures. Optimized processing allows one to attain maximum wire strains of h 8.48 (h ln(A0:A), A: wire cross-section). The wires have very high strength (for instance Cu‐10wt.%Cr‐3wt.%Ag: 1260 MPa at a strain of h8.48) and good electrical conductivity (62% of the conductivity of pure Cu (IACS) at a strain of h 2.5 after solution treatment). Up to wire strains of h:8.5 the strength is equal to that of Cu‐20wt.%Nb. The wire strength is much higher than predicted by the linear rule of mixtures. The investigation presents the evolution of microstructure during the various thermo-mechanical treatments and relates the results to the observed mechanical and electrical properties. The strength is discussed in terms of Hall‐Petch-type hardening.


Japanese Journal of Applied Physics | 2000

Application of In Situ-Formed Metallic-Fiber-Reinforced Copper Matrix Composites to Cables Used for Robots

Koichi Miyake; Noriko Hanzawa; Ryuji Ninomiya; Hidefusa Takahara; Sigeru Kobayashi; Dierk Raabe

The newly developed cable used for a robot was shown to have its excellent durability against cyclic and flexural deformation, when composed of in situ-formed metallic-fiber-reinforced copper matrix composites (in situ MMCs) as electric conductors, where the metallic fiber was, for example, niobium or chromium. The durability determined by a cyclic and flexural deformation test was one order magnitude higher than that of a conventional cable whose electric conductor was composed of a Cu-0.3 mass%Sn alloy. A noteworthy feature observed in the present in situ-formed chromium fiber is that the mean size of the formed chromium ribbon like fiber was below 1.0 µm in width and around 10 nm in thickness, which could result in an extremely high elastic limit of beyond 1000 MPa. The superior durability of the present robot cable is mainly due to the fact that robot operations are in the elastic region of the present electric conductors. The electric conductivity of samples was around 70%IACS (International Annealed Copper Standard).


Archive | 1999

Abrasion resistant copper alloy for build-up cladding on engine cylinder head

Kano Makoto; Hidenobu Matsuyama; Koichi Miyake; Ryuji Ninomiya; Takeshi Ojiro; Kenji Suzuki; Kenji Tsushima


Archive | 1999

Abrasion resistant copper alloy, copper alloy powder for build-up cladding, and engine cylinder head

Ryuji Ninomiya; Takeshi Ojiro; Koichi Miyake; Makoto Kano; Kenji Tsushima; Hidenobu Matsuyama; Kenji Suzuki


Archive | 1994

Solder alloy for heat exchanger

Kohei Kubota; Koichi Miyake; Ryuji Ninomiya; Hiroshi Yamaguchi; 行一 三宅; 耕平 久保田; 隆二 二宮; 洋 山口


Archive | 2010

Lithium ion secondary battery negative electrode collector copper foil, lithium ion secondary battery negative electrode material, and lithium ion secondary battery negative electrode collector selection method

Hideaki Matsushima; Koichi Miyake; Sakiko Tomonaga; 行一 三宅; 咲子 朝長; 英明 松嶋


Archive | 2007

Mg-BASED SOLDER ALLOY

Atsushi Hasegawa; Koichi Miyake; Hiroyuki Shimamura; 行一 三宅; 宏之 島村; 淳 長谷川


Archive | 2013

COPPER FOIL, NEGATIVE ELECTRODE CURRENT COLLECTOR AND NEGATIVE ELECTRODE MATERIAL FOR NON-AQUEOUS SECONDARY BATTERY

Koichi Miyake; Tomoyuki Maeda; Kazutaka Hozumi; Hiroaki Nakahara; Shinichi Yamauchi


Archive | 2016

酸化スズ、燃料電池用電極触媒、膜電極接合体及び固体高分子形燃料電池

Koichi Miyake; 三宅 行一; Susumu Takahashi; 高橋 進; Hiromu Watanabe; 渡邉 彦睦; Naohiko Abe; 阿部 直彦; Ryoma Tsukuda; 附田 龍馬; Kenichi Amitani; 網谷 憲一; Koji Taniguchi; 谷口 浩司; Hiroki Takahashi; 高橋 広己; Yoshihiro Yoneda; 米田 佳弘; Kazuhiko Kato; 加藤 和彦


Archive | 2015

ELECTRO-DEPOSITED COPPER FOIL, METHOD OF SURFACE-TREATED COPPER FOIL MANUFACTURED BY USING ELECTRO-DEPOSITED COPPER FOIL

Sakiko Tomonaga; Koichi Miyake; Kazutaka Hozumi; Hiroaki Nakahara; Yasuhiro Shibata

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Kazuhiko Kato

National Institute of Advanced Industrial Science and Technology

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Naohiko Abe

Tokyo University of Science

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