Koji Omote
Fujitsu
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Publication
Featured researches published by Koji Omote.
Archive | 1998
Koichi Niwa; Koji Omote; Yasushi Goto; Nobuo Kamehara
A1N has a high thermal conductivity and thermal expansion coefficient similar to silicon, and as a result it is a good packaging material for Si semiconductor chips. To increase the thermal conductivity, typically CaCO3 and Y2O3 are used as a firing additives, these additives may lead to the formation of AlCa2O4 and Y3Al5O12 liquid phases during firing, and to the elimination of oxygen from A1N ceramics.1 2
Archive | 2003
Osamu Taniguchi; Yasuo Yamagishi; Koji Omote
Archive | 2002
Osamu Taniguchi; Tomoko Miyashita; Yasuo Yamagishi; Koji Omote; Yoshihiko Imanaka
Archive | 1994
Mineharu Tsukada; Koji Omote
Archive | 2006
Keishiro Okamoto; Takeshi Shioga; Osamu Taniguchi; Koji Omote; Yoshihiko Imanaka; Yasuo Yamagishi
Sensors and Actuators A-physical | 2003
Masao Kondo; Masaharu Hida; Koji Omote; Osamu Taniguchi; Tsuyoshi Mita; Shigeyoshi Umemiya; Kazuaki Kurihara
Archive | 2002
Osamu Taniguchi; Tomoko Miyashita; Yasuo Yamagishi; Koji Omote; Yoshihiko Imanaka
Archive | 1994
Mineharu Tsukada; Masaharu Hida; Koji Omote
Archive | 2001
Yoshihiko Imanaka; Tomoko Miyashita; Koji Omote; Osamu Taniguchi; Yasuo Yamagishi; 佳彦 今中; 智子 宮下; 康男 山岸; 孝司 表; 修 谷口
Archive | 2003
Koji Omote; Masataka Mizukoshi; Osamu Taniguchi
