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Kotake Tomohiko

Hitachi

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Publication

Featured researches published by Kotake Tomohiko.

Archive | 2010

Thermosetting insulating resin composition, and insulating film with support, prepreg, laminated board and multilayer printed wiring board using the same

Kotake Tomohiko; Tsuchikawa Shinji; Izumi Hiroyuki; Murai Akira

Archive | 2011

Thermosetting resin composition, prepreg using the same, and laminated board

Tsuchikawa Shinji; Kotake Tomohiko; Izumi Hiroyuki; Murai Akira

Archive | 2014

Thermosetting resin composition, and prepreg, laminate and printed wiring board using the same

Hashimoto Shintaro; Miyatake Masato; Kotake Tomohiko; Nagai Shunsuke; Inoue Yasuo; Takanezawa Shin; Murai Hikari

Archive | 2010

THERMOSETTING INSULATING RESIN COMPOSITION, AND PREPREG, FILM WITH RESIN, LAMINATE AND MULTILAYER PRINTED WIRING BOARD USING THE SAME

Kotake Tomohiko; Tsuchikawa Shinji; Izumi Hiroyuki; Akiyama Masanori; Murai Akira

Archive | 2014

THERMOSETTING RESIN COMPOSITION AND PREPREG, LAMINATE SHEET, AND MULTILAYER PRINTED WIRING BOARD USING THE SAME

Kotake Tomohiko; Nagai Shunsuke; Miyatake Masato; Hashimoto Shintaro; Takanezawa Shin; Murai Hikari

Archive | 2014

Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, resin-equipped film, laminated plate, multilayer printed circuit board, and semiconductor package

Kotake Tomohiko; Nagai Shunsuke; Hashimoto Shintaro; Abe Shinichiro; Miyatake Masato; Takanezawa Shin; Murai Hikari

Archive | 2014

AMINO-MODIFIED SILOXANE COMPOUND, MODIFIED IMIDE RESIN, THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN-CLAD FILM, LAMINATE SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

Kotake Tomohiko; Nagai Shunsuke; Hashimoto Shintaro; Abe Shinichiro; Miyatake Masato; Takanezawa Shin; Murai Hikari

Archive | 2014

Amino-modified siloxane compound, modified imide resin, thermosetting resin composition, prepreg, resin-equipped film, laminated plate, multilayer printed circuit board, and semiconductor package

Kotake Tomohiko; Nagai Shunsuke; Hashimoto Shintaro; Abe Shinichiro; Miyatake Masato; Takanezawa Shin; Murai Hikari

Archive | 2012

PREPREG, LAMINATED PLATE, AND PRINTED WIRING BOARD USING THERMOCURABLE RESIN COMPOSITION

Miyatake Masato; Kotake Tomohiko; Nagai Shunsuke; Takanezawa Shin; Murai Akira; Uchimura Ryoichi; Takahara Naoki

Archive | 2011

THERMOSETTING INSULATING RESIN COMPOSITION AND INSULATING FILM WITH SUBSTRATE USING THE SAME, PREPREG, LAMINATED BOARD, AND MULTILAYER PRINTED CIRCUIT BOARD

Kotake Tomohiko; Tsuchikawa Shinji; Akiyama Masanori; Izumi Hiroyuki

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Miyatake Masato

Hitachi

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Murai Hikari

Hitachi

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Takanezawa Shin

Mitsubishi

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Izumi Hiroyuki

Hitachi

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Kikkawa Chisato

Hitachi

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Tsuchikawa Shinji

Hitachi

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