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Featured researches published by Kouichi Meguro.


IEEE Transactions on Advanced Packaging | 2007

Low-Cost Vacuum Molding Process for BGA Using a Large Area Substrate

Masanori Onodera; Kouichi Meguro; Junji Tanaka; Yasuhiro Shinma; Koji Taya; Junichi Kasai

We have developed a new ball grid array vacuum molding process using a large area substrate, called vacuum dip compression molding (VDCM), with the aim of reducing the substrate molding cost. The VDCM method imposes less of a burden on the environment because it enables efficient use of the substrate area for packaging, increasing the proportion of the effective area on the substrate. In contrast to the transfer molding method, VDCM does not generate cull or runner waste. VDCM also has the advantage of reducing the thickness of the mold resin. It can mold packages with various thicknesses using a single mold. Using VDCM equipment, we conducted a basic evaluation of molding performance. It was confirmed that no significant wire sweep occurred even when the wire length exceeded 3 mm, indicating that VDCM is less prone to wire sweep compared to transfer molding. The prototyped fine pitch ball grid arrays had a satisfactory level of moisture sensitivity.


Archive | 2009

SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD

Koji Taya; Masanori Onodera; Junji Tanaka; Kouichi Meguro


Archive | 2006

Semiconductor device, fabrication method therefor, and film fabrication method

Junichi Kasai; Kouichi Meguro; Masanori Onodera


Archive | 2007

Carrier for stacked type semiconductor device and method of fabricating the same

Masanori Onodera; Junichi Kasai; Kouichi Meguro; Junji Tanaka; Yasuhiro Shinma; Koji Taya


Archive | 2006

Stacked type semiconductor device and method of fabricating stacked type semiconductor device

Yasuhiro Shinma; Masanori Onodera; Kouichi Meguro; Koji Taya; Junji Tanaka; Junichi Kasai


Archive | 2006

Computing device including a stacked semiconductor device

Masanori Onodera; Kouichi Meguro; Junji Tanaka


Archive | 2005

Stacked type semiconductor device and method for manufacturing same

Masanori Onodera; Kouichi Meguro; Junichi Kasai


Archive | 2005

Ic Carrier, Ic Socket and Method for Testing Ic Device

Eichi Osato; Junichi Kasai; Kouichi Meguro; Masanori Onodera


Archive | 2005

Carrier structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor device

Masanori Onodera; Kouichi Meguro; Junichi Kasai; Yasuhiro Shinma; Koji Taya; Junji Tanaka


Archive | 2005

Semiconductor device, its fabrication method, and film fabrication method

Junichi Kasai; Kouichi Meguro; Masanori Onodera

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