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Featured researches published by Kouji Wada.


Welding International | 2009

Effect of bonding conditions on joints of 5052Al and 6063Al in pulsed electric current bonding

Katsuya Kondou; Nobuhiro Matsumoto; Kouji Wada; Osamu Ohashi

Recent reports on sintering and bonding using the pulsed electric current bonding process indicate that the metals are subjected to Joule heating due to the electrical resistance at the contact points. However, the influence of bonding conditions on local heating phenomena and joint quality remains unclear. In this study, the effects of bonding conditions (bonding temperature, pressure, surface roughness, interlayer, electric current wave and so on) on joint efficiency are investigated using 5052A1 and 6063A1 in pulsed electric current bonding. The joint strength of 5052A1 and 6063A1 are improved using 2024A1 as the interlayer between the bonding interfaces. The joints with the 2024A1 powder as the interlayer are stronger than ones with 2024A1 plate, and are as strong as the base metal. The improvements of the joints depend on effective heat generation at the bonding interface due to the electrical resistance. It is 0.08 g (thickness: 0.04 mm), enough for the amount of powder between the bonding interfaces. The dispersion of the powder from the joints does not occur under various conditions. The surface roughness and electric current wave (direct current, duty ratio, pulse frequency) have no effect on the joint strength. With the increase of bonding temperature and pressure, the deformation of the joints increases. Then bonding temperature and pressure have to be selected to prevent a big deformation of joint configuration.


Welding International | 2011

Effects of post heat treatment on 5052Al and 6063 aluminium joints during pulsed electric current bonding

Minefumi Matsui; Katsuya Kondou; Kouji Wada; Osamu Ohashi

In a previous study, the effects of the bonding conditions (bonding temperature, pressure, surface roughness, interlayer and electric current wave) on joint efficiency were investigated using 5052Al and 6063Al joints during pulsed electric current bonding. The results were found as follows. The surface roughness and current waveform (direct current, duty ratio and pulsed frequency) show no effect on the joint strength. With an increase in the bonding temperature and pressure, the deformation of the joints increase. The bonding temperature and pressure have to be selected in way to prevent significant deformation of the joint configuration. In the current study, the effect of the post heat treatment on the joints is under investigation to improve the joint strength of 5052Al and 6063Al. Post heat treatments the 5052Al and 6063Al joints improve the strength of both of them. The effect of the post heat treatment on the 6063Al joint is larger than the effect on the 5052Al joint. Post heat treatment performed on the joints promoted a Mg reduction mechanism by Al alloys to remove an oxide film at the bond interface. Based on the tensile properties and the microstructure of the joints, an optimum amount of Mg is added in order to improve the joint properties of the Al alloy, which was determined to be 0.3–1 mass percentage. Using a solution and ageing heat treatment, the joint properties of 6063Al equal the joint properties of a base metal.


Archive | 2008

BONDING METHOD AND APPARATUS THEREFOR

Osamu Ohashi; Keiichi Minegishi; Yasunori Yoshida; Kouji Wada


Journal of The Japan Institute of Metals | 2006

Effect of Electric Current Wave on Joints in Pulsed Electric Current Bonding

Noriyuki Chikui; Hajime Furuhata; Kouji Wada; Osamu Ohashi


Archive | 2008

Laminated structure for a fluid

Keiichi Minegishi; Yasunori Yoshida; Kouji Wada; Youichi Kawamura


Archive | 2008

FLUID FLOW PASSSAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Keiichi Minegishi; Yasunori Yoshida; Kouji Wada; Youichi Kawamura


Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2006

Interface microstructure of aluminum die-casting alloy joints bonded by pulse electric-current bonding process

Guoqiang Xie; Osamu Ohashi; Kouji Wada; Takayuki Ogawa; Minghui Song; Kazuo Furuya


Archive | 2008

FLUID PRESSURE DEVICE AND MANUFACTURING METHOD FOR FLUID PRESSURE DEVICE

Keiichi Minegishi; Yasunori Yoshida; Kouji Wada; Youichi Kawamura


Journal of The Japan Society of Powder and Powder Metallurgy | 2008

Behavior of Powder as Interlayer Materials of Joints in Pulsed Electric Current Bonding

Katsuya Kondou; Kenji Yuza; Kouji Wada; Osamu Ohashi


Archive | 2009

Fluiddurchgangsstruktur und Herstellungsverfahren hierfür

Keiichi Minegishi; Yasunori Yoshida; Kouji Wada; Youichi Kawamura

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Guoqiang Xie

National Institute for Materials Science

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Kazuo Furuya

National Institute for Materials Science

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Minghui Song

National Institute for Materials Science

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