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Dive into the research topics where Kunpeng Cai is active.

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Featured researches published by Kunpeng Cai.


PLOS ONE | 2013

Unipolar memristive Switching in Bulk Negative Temperature Coefficient Thermosensitive Ceramics

Hongya Wu; Kunpeng Cai; Ji Zhou; Bo Li; Longtu Li

A memristive phenomenon was observed in macroscopic bulk negative temperature coefficient nickel monoxide (NiO) ceramic material. Current-voltage characteristics of memristors, pinched hysteretic loops were systematically observed in the Ag/NiO/Ag cell. A thermistor-based model for materials with negative temperature coefficient was proposed to explain the mechanism of the experimental phenomena. Most importantly, the results demonstrate the potential for a realization of memristive systems based on macroscopic bulk materials.


Applied Physics Letters | 2010

Hysteretic current-voltage characteristic in polycrystalline ceramic ferrites

Kunpeng Cai; Rui Wang; Bo Li; Ji Zhou

Electric transport properties of sintered polycrystalline Zn0.6Mn0.4Fe2O4 ferrite prepared by traditional solid reaction method were studied. A hysteretic current-voltage characteristic was found, and it could be tuned by both relatively low electric field and magnetic field at room temperature. A magnetic hysteresis related electron transmission model was proposed to explain the results. The tunable electric transport properties are potentially significant for electronic applications, such as nonvolatile random access memories, memristors, and other circuit elements with memory.


Applied Physics A | 2011

Direct-writing construction of layered meshes from nanoparticles-vaseline composite inks: rheological properties and structures

Kunpeng Cai; Jingbo Sun; Qi Li; Rui Wang; Bo Li; Ji Zhou


Applied Physics A | 2003

A novel anti-spatter and anti-crack laser drilling technique: application to ceramics

Dan Guo; Kunpeng Cai; Yong Huang; Liangliang Li


Applied Physics A | 2000

Electrodeposition of diamond-like amorphous carbon films on aluminum from acetonitrile

Kunpeng Cai; Dan Guo; Yong Huang; Hesun Zhu


Applied Physics A | 2002

Evaluation of carbon films electrodeposited on different substrates from different organic solvents

Dan Guo; Kunpeng Cai; Liangliang Li; Yong Huang; Zhilun Gui


Journal of Inorganic Materials | 2011

TiO 2 Photolysis Device Fabricated by Direct Ink Write Assembly: TiO 2 Photolysis Device Fabricated by Direct Ink Write Assembly

Jing-Bo Sun; Bo Li; Kunpeng Cai; Ji Zhou; Long-Tu Li


Journal of Inorganic Materials | 2009

Direct-write Assembly of Ceramic Three-dimensional Structures Based on Photosensitive Inks: Direct-write Assembly of Ceramic Three-dimensional Structures Based on Photosensitive Inks

Jing-Bo Sun; Bo Li; Xue-Guang Huang; Kunpeng Cai; Ji Zhou; Long-Tu Li


ECS Journal of Solid State Science and Technology | 2013

Hysteretic Current-Voltage Characteristics and Memristive Behaviors in AgI Nano-Particles Assembly

Kunpeng Cai; Jingbo Sun; Bo Li; Ji Zhou


Archive | 2012

Die-free and direct-writing preparation method for three-dimensional structure of ceramic substrate and ceramic substrate photosensitive slurry

Bo Li; Jingbo Sun; Kunpeng Cai; Ji Zhou; Longtu Li; Qinmei Peng; Xiaolong Zhang; Shuiyuan Su

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Bo Li

Tsinghua University

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