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Kuo-Chung Yee

TSMC

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Publication

Featured researches published by Kuo-Chung Yee.

Archive | 2013

THERMALLY CONDUCTIVE STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTOR PACKAGES

Chun-Hao Tseng; Ying-hao Kuo; Kuo-Chung Yee

Archive | 2013

VACUUM CARRIER MODULE, METHOD OF USING AND PROCESS OF MAKING THE SAME

Tien-Yu Huang; Chun-Hao Tseng; Ying-hao Kuo; Kuo-Chung Yee

Archive | 2015

Apparatus and method for chip placement and molding

Jui Hsieh Lai; Ying-hao Kuo; Kuo-Chung Yee

Archive | 2013

THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTOR PACKAGES

Chun-Hao Tseng; Ying-hao Kuo; Kuo-Chung Yee

Archive | 2013

METHOD FOR FORMING SEMICONDUCTOR PACKAGE USING CARBON NANO MATERIAL IN MOLDING COMPOUND

Chun-Hao Tseng; Ying-hao Kuo; Kuo-Chung Yee

Archive | 2016

Apparatus and method for self-aligning chip placement and leveling

Jui Hsieh Lai; Ying-hao Kuo; Kuo-Chung Yee

Archive | 2015

Temporary Bonding Scheme

Wan-Yu Lee; Ying-hao Kuo; Kuo-Chung Yee

Archive | 2013

Apparatus and method of forming chip package with waveguide for light coupling

Chun-Hao Tseng; Ying-hao Kuo; Kuo-Chung Yee

Archive | 2013

Manufacture including substrate and package structure of optical chip

Wan-Yu Lee; Chun-Hao Tseng; Jui Hsieh Lai; Tien-Yu Huang; Ying-hao Kuo; Kuo-Chung Yee

Archive | 2013

Light coupling formation in a waveguide layer

Chun-Hao Tseng; Ying-hao Kuo; Kuo-Chung Yee

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Ying-hao Kuo

TSMC

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Chun-Hao Tseng

TSMC

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Jui Hsieh Lai

TSMC

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Tien-Yu Huang

TSMC

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Wan-Yu Lee

TSMC

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