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Kuo Tin-Hao

TSMC

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Publication

Featured researches published by Kuo Tin-Hao.

Archive | 2013

Trace Layout Method in Bump-on-Trace Structures

Tseng Yu-Jen; Chen Guan-Yu; Wu Sheng-Yu; Yu Chen-Hua; Lii Mirng-Ji; Chen Chen-Shien; Kuo Tin-Hao

Archive | 2012

Device and method of manufacturing low stress chip package array

Yu Chen-Hua; Tsai Hao-Yi; Wu Jiun-Yi; Kuo Tin-Hao

Archive | 2014

Bump on trace structure and method for forming the same, chip-to-chip structure

Lin Yu-Wei; Wu Sheng-Yu; Tseng Yu-Jen; Kuo Tin-Hao; Chen Chen-Shien

Archive | 2013

Semiconductor structure and method of forming devices

Shen Cheng Hung; Kuo Tin-Hao; Kuo Chen-Cheng; Chen Chen-Shien; Chuang Yao-Chun

Archive | 2013

Packages, methods of packaging a device and package on package devices

Hu Yen-Chang; Hsiao Ching-Wen; Chen Chih-Hua; Chen Chen-Shien; Kuo Tin-Hao

Archive | 2018

INTEGRATED FAN-OUT PACKAGE

Chang Chih-Hao; Liao Hsin-Hung; Tsai Hao-Yi; Hwang Chien-Ling; Chang Wei-Sen; Chiang Tsung-Hsien; Kuo Tin-Hao

Archive | 2017

INTEGRIERTES FAN-OUT-GEHÄUSE UND VERFAHREN ZU SEINER HERSTELLUNG

Yee Kuo-Chung; Tsai Hao-Yi; Yu Chen-Hua; Kuo Tin-Hao

Archive | 2017

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH FAN-OUT STRUCTURE

Chen Shing-Chao; Lin Chih-Wei; Chen Meng-Tse; Huang Hui-Min; Cheng Ming-Da; Pan Kuo-Lung; Chang Wei-Sen; Kuo Tin-Hao; Tsai Hao-Yi

Archive | 2016

INTEGRATED CIRCUIT PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD

Lin Yu-Wei; Chen Chen-Shien; Chen Guan-Yu; Kuo Tin-Hao; Lin Yen-Liang

Archive | 2016

Method And Device Used For Packaging Boss Chip On Trace

Lin Yen-Liang; Huang Chang-Chia; Kuo Tin-Hao; Wu Sheng-Yu; Chen Chen-Shie

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Collaboration

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Chen Chen-Shien

TSMC

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Wu Sheng-Yu

TSMC

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Lin Yen-Liang

TSMC

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Lin Yu-Wei

TSMC

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Tseng Yu-Jen

TSMC

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Chang Chih-Horng

TSMC

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Lii Mirng-Ji

TSMC

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Tsai Hao-Yi

TSMC

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Tsai Pei-Chun

TSMC

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Yu Chen-Hua

TSMC

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