Kurt E. Kneidel

Development of SOFC Stack Using Low-Cost and Low-ASR Ceramic Interconnects

The multi-layer ceramic (MLC) interconnect is fabricated using multiple layers of YSZ tape, with each layer containing conductive vias to provide for electrical current flow through the interconnect. Fuel and air supply to cells is accomplished through the use of flow passages in the layers. MLC interconnect using low-cost conductive materials as vias was developed. All ceramic SOFC stacks utilizing electrolyte-supported cells and MLC interconnect with low-cost vias were built and tested, low-ASR and long term stable performance of which was demonstrated. pO2 simulation in low-cost vias was performed under different fuel utilization, and confirmed that lowcost conductive via materials have low ASR in normal SOFC stack operation conditions.