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Dive into the research topics where L D Bollinger is active.

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Featured researches published by L D Bollinger.


Rochester - DL tentative | 1992

Rapid optical figuring of aspherical surfaces with plasma-assisted chemical etching

L D Bollinger; George N. Steinberg; Charles B. Zarowin

Programmed motion of a tool which removes material by plasma assisted chemical etching (PACE) gives controlled, deterministic figuring. The process has been automated to correct arbitrary figure errors on aspheric surfaces directly from the measured surface data. A system is now operating for figuring aspheric surfaces up to 0.5 m diameter. PACE can greatly reduce the time and cost of figuring large optics by its rapid convergence to the final figure requiring only two to three measurement/figuring cycles to reach 1/50 wave surfaces. PACE intrinsically smooths high frequency roughness with material removal leaving a surface free of subsurface damage


Archive | 1991

System for removing material from semiconductor wafers using a contained plasma

Charles Zarowin; L D Bollinger


Advanced Optical Manufacturing and Testing | 1990

Rapid, noncontact optical figuring of aspheric surfaces with plasma-assisted chemical etching

L D Bollinger; Gregg M. Gallatin; J. Samuels; George N. Steinberg; Charles B. Zarowin


Archive | 1998

System and method for controlling and executing the etching of a wafer

Charles B. Zarowin; L D Bollinger


Archive | 1992

System for removing meterial from a wafer

Charles B Zarowin; L D Bollinger


Archive | 1992

Einrichtung und Verfahren zur Kontrolle und Durchführung der Ätzung eines Wafers Apparatus and method for monitoring and implementation of etching a wafer

Charles B Zarowin; L D Bollinger


Archive | 1992

Verfahren und Geräte zur Einschränkung des Plasma-Ätzgebietes zur Erlangung präziser Formgestaltung von Substratöberflächen Method and device for limiting the plasma Ätzgebietes to obtain precise shaping of Substratöberflächen

Charles B Zarowin; L D Bollinger


Archive | 1992

System for controlling and executing the etching of a wafer

Charles B. Zarowin; L D Bollinger


Archive | 1992

Verfahren und Geräte zur Einschränkung des Plasma-Ätzgebietes zur Erlangung präziser Formgestaltung von Substratöberflächen

Charles B Zarowin; L D Bollinger


Archive | 1992

Einrichtung und Verfahren zur Kontrolle und Durchführung der Ätzung eines Wafers Apparatus and method for controlling and performing the etching of a wafer

Charles B Zarowin; L D Bollinger

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