L.J. Hanekamp

Determination of complex dielectric functions of ion implanted and implanted‐annealed amorphous silicon by spectroscopic ellipsometry

Measuring with a spectroscopic ellipsometer (SE) in the 1.8–4.5 eV photon energy region we determined the complex dielectric function (ϵ = ϵ1 + iϵ2) of different kinds of amorphous silicon prepared by self‐implantation and thermal relaxation (500 °C, 3 h). These measurements show that the complex dielectric function (and thus the complex refractive index) of implanted a‐Si (i‐a‐Si) differs from that of relaxed (annealed) a‐Si (r‐a‐Si). Moreover, its ϵ differs from the ϵ of evaporated a‐Si (e‐a‐Si) found in the handbooks as ϵ for a‐Si. If we use this ϵ to evaluate SE measurements of ion implanted silicon then the fit is very poor. We deduced the optical band gap of these materials using the Davis–Mott plot based on the relation: (ϵ2E2)1/3 ∼ (E− Eg). The results are: 0.85 eV (i‐a‐Si), 1.12 eV (e‐a‐Si), 1.30 eV (r‐a‐Si). We attribute the optical change to annihilation of point defects.

Nondestructive determination of damage depth profiles in ion‐implanted semiconductors by spectroscopic ellipsometry using different optical models

A several‐parameter fitting of spectroscopic ellipsometry data is developed to characterize near‐surface layers in semiconductors damaged by implantation. The damage depth profiles are described by either rectangular, trapezoid‐type, or coupled half‐Gaussian (realistic) optical models. The rectangular model has three parameters: the average damage level, the effective thickness of the implanted layer, and the thickness of the native oxide. The trapezoid‐type model is enhanced with a fourth parameter, the width of the amorphous/crystalline interface. The realistic optical model consists of a stack of layers with fixed and equal thicknesses. The damage levels are determined by a depth profile function (presently coupled half‐Gaussians). Five parameters are used: the position of the maximum, the height, and two standard deviations of the profile, plus the thickness of the native oxide. The complex refractive index of each layer is calculated from the actual damage level by the Bruggeman effective medium appr...

Ion-implantation induced anomalous surface amorphization in silicon

Spectroscopic ellipsometry (SE), high-depth-resolution Rutherford backscattering (RBS) and channeling have been used to examine the surface damage formed by room temperature N and B implantation into silicon. For the analysis of the SE data we used the conventional method of assuming appropriate optical models and fitting the model parameters (layer thicknesses and volume fraction of the amorphous silicon component in the layers) by linear regression. The dependence of the thickness of the surface-damaged silicon layer (beneath the native oxide layer) on the implantation parameters was determined: the higher the dose, the thicker the disordered layer at the surface. The mechanism of the surface amorphization process is explained in relation to the ion beam induced layer-by-layer amorphization. The results demonstrate the applicability of Spectroscopic ellipsometry with a proper optical model. RBS, as an independent cross-checking method supported the constructed optical model.

Nondestructive characterization of nitrogen-implanted silicon-on-insulator structures by spectroscopic ellipsometry

Silicon‐on‐insulator structures implanted by 200‐keV nitrogen with a dose of 7.5×1017 atoms/cm2 were studied by spectroscopic ellipsometry (SE). The SE measurements were carried out in the 300–700‐nm wavelength (4.13–1.78‐eV photon energy) range. For the analysis of the SE data we used the conventional method of assuming appropriate optical models and fitting the model parameters (layer thicknesses and compositions) by linear regression. Calculated data were in good agreement with measurements when a seven‐layer model, consisting of surface oxide layer, thick silicon layer, upper two interface layers, thick nitride layer, and lower two interface layers, was applied. Results obtained by SE were compared with those from Rutherford backscattering spectroscopy (RBS) and transmission electron microscopy. In contrast with RBS measurements, we found that the sensitivity of our optical model combined with the fitting technique was good enough to resolve the silicon‐rich transition layers at the upper and lower in...

Effects on ellipsometric parameters caused by heat treatment of silicon (111) surface

Heating of a silicon single crystal introduces a surface roughness. Crystals are heated for periods of 45 sec in the temperature range from 560 to 1150°C. Using ellipsometry, Auger electron spectroscopy, mass spectroscopy and micrography it has been shown that the changes in the ellipsometric parameters are caused by surface roughness which in turn is strongly related to the sublimation of silicon during heating. The relation between surface roughness and temperature of the crystal during the heating is not linear.

Non-destructive characterization of nitrogen-implanted silicon-on-insulator structures by spectroscopic ellipsometry

Silicon-on-insulator (SOI) structures implanted with 200 or 400 keV N+ ions at a dose of 7.5 × 1017cm−2 were studied by spectroscopic ellipsometry (SE). The SE measurements were carried out in the 300–700 nm wavelength (4.13-1.78 eV photon energy) range. The SE data were analysed by the conventional method of using appropriate optical models and linear regression analysis. We applied a seven-layer model (a surface oxide layer, a thick silicon layer, upper two interface layers, a thick nitride layer and lower two interface layers) with good results. The fitted parameters were the layer thickness and compositions. The results were compared with data obtained from Rutherford backscattering spectroscopy (RBS) and transmission electron microscopy. The sensitivity of our optical model and fitting technique was good enough to distinguish between the silicon-rich transition layers near the upper and lower interfaces of the nitride layer, which are unresolvable in RBS measurements.

Characterization of tungsten tips for STM by SEM/AES/XPS

SummaryFor the first time, both X-ray Photoelectron Spectroscopy (XPS) and Auger Electron Spectroscopy (AES) techniques were applied in analysis of surface contamination of electrochemically etched Scanning Tunneling Microscope (STM) tungsten tips. Carbon monoxide, graphite, tungsten carbide and tungsten oxide were found as main surface contaminations of STM tungsten tips. The thickness of tungsten oxide layers was estimated to be about 1–3 nm. Quantitative analysis of surface and bulk concentration of carbon, oxygen and tungsten has been performed.

Comparative investigation of damage induced by diatomic and monoatomic ion implantation in silicon

The damaging effect of mono- and diatomic phosphorus and arsenic ions implanted into silicon was investigated by spectroscopic ellipsometry (SE) and high-depth-resolution Rutherford backscattering and channeling techniques. A comparison was made between the two methods to check the capability of ellipsometry to examine the damage formed by room temperature implantation into silicon. For the analysis of the spectroscopic ellipsometry data we used the conventional method of assuming appropriate optical models and fitting the model parameters (layer thicknesses and volume fractions of the amorphous silicon component in the layers) by linear regression. The depth dependence of the damage was determined by both methods. It was revealed that SE can be used to investigate the radiation damage of semiconductors together with appropriate optical model construction which can be supported or independently checked by the channeling method. However, in case of low level damage (consisting mainly of isolated point defects) ellipsometry can give false results, overestimating the damage using inappropriate dielectric functions. In that case checking by other methods like channeling is desirable.

Ion-implantation-caused special damage profiles determined by spectroscopic ellipsometry in crystalline and in relaxed (annealed) amorphous silicon

We previously developed a fitting method of several parameters to evaluate ion-implantation-caused damage profiles from spectroscopic ellipsometry (SE) (M. Fried et al., J. Appl. Phys., 71 (1992) 2835). Our optical model consists of a stack of layers with fixed and equal thicknesses and damage levels described by a depth profile function (coupled half Gaussians). The complex refractive index of each layer is calculated from the actual damage level by Bruggeman effective medium approximation (EMA) using crystalline (c-Si) and amorphous (a-Si) silicon as end-points. Two examples are presented of the use of this method with modified optical models. First, we investigated the surface damage formed by room temperature B+ and N+ implantation into silicon. For the analysis of the SE data we added a near surface amorphous layer to the model with variable thickness. Second, we determined 20 keV B+ implantation-caused damage profiles in relaxed (annealed) amorphous silicon. In this special case, the complex refractive index of each layer was calculated from the actual damage level by the EMA using relaxed a-Si and implanted a-Si as end-points. The calculated profiles are compared with Monte Carlo simulations (TRIM code); good agreement is obtained.

In-depth compositional analysis of ceramic (Bi2O3)0.75(Er2O3)0.25 by AES and XPS

The chemical composition of dense ceramics of erbia-stabilized δ-Bi2O3 was analyzed by Auger electron spectroscopy (AES) depth profiling using Ar+ ion sputtering. The relative sensitivity factors (rsf) and sputter rates of bismuth and erbium in this material have been determined by electron probe microanalysis (EPMA) and chemical analysis. These results, supplemented by data from angle resolved X-ray photoelectron spectroscopy (ARXPS), shows a bismuth enrichment at the surface. Evidence has been found for reduction of the bismuth-oxide at the outermost part of the surface layer.